The effect of grain boundary deformation on the creep micro-deformation of copper

Carolan, R.A.; Egashira, Mitsuru; Kishimoto, Seiji; Shinya, Norio

doi:10.1016/0956-7151(92)90105-n

Cited by 13 publications

(4 citation statements)

References 11 publications

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“…In contrast to the grid [9][10][11][12][13][14][15][16][17][18] and moiré [19][20][21][22][23][24][25] techniques, the speckle technique does not require the preparation of a grating on the specimen surface. This is obviously a big advantage in studying thin film specimens, which are small, delicate and difficult to handle.…”

Section: Background: Speckle Interferometrymentioning

confidence: 99%

Young's modulus of thin films by speckle interferometry

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1998

Meas. Sci. Technol.

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Speckle interferometry has been applied to the measurement of Young's modulus in thin films. The present study has two novel aspects: the specimens used were approximately 1 µm thick and less than 1 mm long, so the speckle images were obtained by photomicroscopy; and the digital images were analysed by quantitative treatment at intense speckles, rather than by the more standard techniques. Displacements and strains within the gauge length were obtained with low statistical uncertainties. Young's modulus values for three varieties of copper thin films were obtained. All were lower than the polycrystalline bulk average value and the electrodeposited film's modulus was lower than those of both the vapour-deposited films.

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Section: Background: Speckle Interferometrymentioning

confidence: 99%

Young's modulus of thin films by speckle interferometry

Read

1998

Meas. Sci. Technol.

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“…Gold or platinum microgrids are usually chosen for room or intermediate temperature (up to 500°C) experiments [6,7,8]. Unfortunately, microgrid technique is seldom used for high temperature micromechanical studies because of thermal instability of the grid [9].…”

Section: High Temperature Microgridsmentioning

confidence: 99%

Grain Boundary and Intragranular Deformations during High Temperature Creep of a PM Nickel-Based Superalloy

Soula¹,

Renollet²,

Boivin³

et al. 2008

Superalloys 2008 (Eleventh International Symposium)

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Grain boundary and intragranular deformations have been analysed during high temperature creep of a PM nickel-based superalloy. Local deformation has been quantified using an original microextensometry technique. This technique consists in calculating deformation of ceramic square grids deposited on flat specimens thanks to an electron lithography technique. Grain boundary sliding (GBS) was quantified by measuring microgrid offsets at grain boundaries. Strain maps and GBS maps have been computed. Superimposition with electron back scattered diffraction (EBSD) maps allowed studying the influence of grain boundary character on their deformation behaviour. The effectiveness of this technique was demonstrated through creep test performed at 700, 750 and 800°C under an applied stress of 700 MPa. The results showed that grain boundary and intragranular mechanisms of deformation accommodate one's each other to preserve the continuity of deformation in the material. Modification of deformation mechanisms within grains was related to coarsening of tertiary γ' precipitates with increase of temperature. Simultaneously, decrease of GBS contribution was observed when temperature increases.

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“…There are several strengths of this technique that make it highly suitable for measuring displacement and strain distributions in biscuits. First of all, the method is non-contacting and does not require modification of the specimen, such as the preparation of a grating on the specimen surface as in grid [13][14][15][16][17] and moiré [18][19][20][21][22] techniques. It therefore enables determination of the required displacement and strain information without any physical contact with the sample or reinforcement of it-a big advantage when studying biscuits, which are delicate and difficult to handle.…”

Section: Experimental Methodology For Biscuit Materialsmentioning

confidence: 99%

A novel application of speckle interferometry for the measurement of strain distributions in semi-sweet biscuits

Saleem

Wildman

Huntley

et al. 2003

Meas. Sci. Technol.

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The spontaneous formation of cracks in biscuits following baking, also known as checking, is an issue that manufacturers would like to be able to predict and avoid. Unfortunately the mechanisms driving this phenomenon are not well understood. Speckle interferometry was used to study moisture-induced in-plane strain development in biscuits. This sensitive and non-contacting technique for measuring surface displacements has two major advantages over more commonly used methods; firstly, strains can be detected at a far higher sensitivity (down to 2 × 10 −6) than previously accessible and secondly the method is a whole-field technique, enabling observation of the development of strain distributions during moisture migration. For biscuits exposed to step changes in humidity, initial strain rates of up to 10 −5 min −1 were measured, which decreased as the moisture content approached equilibrium, leading to an accumulated strain of ∼10 −2 after 48 h. Under these conditions, a homogeneous, uniform strain distribution was observed. The data were used to calculate the hygroscopic expansion coefficient, which was linearly related to moisture content and provides the necessary constitutive link between strain and biscuit moisture content needed to model biscuit checking.

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The effect of grain boundary deformation on the creep micro-deformation of copper

Cited by 13 publications

References 11 publications

Young's modulus of thin films by speckle interferometry

Young's modulus of thin films by speckle interferometry

Grain Boundary and Intragranular Deformations during High Temperature Creep of a PM Nickel-Based Superalloy

A novel application of speckle interferometry for the measurement of strain distributions in semi-sweet biscuits

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