The effect of grain boundary character distribution on the high temperature deformation behavior of Ni–16Cr–9Fe alloys

Alexandreanu, B.; Sencer, Bulent H.; Thaveeprungsriporn, Visit; Was, Gary S.

doi:10.1016/s1359-6454(03)00207-6

Cited by 72 publications

(22 citation statements)

References 32 publications

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“…This could indirectly result in more aggregation of dislocations near the boundary, particularly as there is less free volume in special (as compared to random) boundaries, thereby strengthening the boundary region. This effect has been observed locally near individual boundaries by Alexandreanu et al, [36] and the effect of an increased special fraction on the constitutive response has been documented by Kumar et al [37] …”

Section: Elevated Temperaturesmentioning

confidence: 66%

High-cycle fatigue of nickel-based superalloy ME3 at ambient and elevated temperatures: Role of grain-boundary engineering

Gao

Ritchie

Kumar

et al. 2005

Metall Mater Trans A

129

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Section: Elevated Temperaturesmentioning

confidence: 66%

High-cycle fatigue of nickel-based superalloy ME3 at ambient and elevated temperatures: Role of grain-boundary engineering

Gao

Ritchie

Kumar

et al. 2005

Metall Mater Trans A

129

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“…The use of both Pareto Anova technique and S/N ratio approach makes it less cumbersome to analyse the results and hence, make it fast to arrive at the conclusion. Alexandreanu et al (2003) conducted the experiments on effect of grain boundary character distribution on the high temperature distribution behaviour of Ni-16 Cr-9 Fe alloys using statistical analysis of variance and suggested that the hardness in the vicinity of coincident site lattice boundaries (CSLBs), and the grain-averaged hardness increases with fraction of contiguous CSLBs. Keller et al (2010) conducted TEM study of dislocation patterns near surface and core regions of deformed nickel poly crystals across the cross section using statistical analysis of variance and suggested that a surface effect appears with a decrease of intragranular internal back stress near the free surface independently of the number of grains across the thickness.…”

Section: Anovamentioning

confidence: 99%

Influence of process parameters on the cup drawing of aluminium 7075 sheet

Venkateswarlu¹,

Davidson²,

Tagore³

2011

Int. J. Eng. Sci. Tech

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AA7075 is one of the most important structural materials extensively used in automobile and aerospace industries. Extensive research on its formability aspects is required to develop useful components of complex shapes out of this material. One of the ways to measure the formability is to find its deep drawability characteristics. In this study, the significance of three important deep drawing process parameters namely blank temperature, die arc radius and punch velocity on the deep drawing characteristics of aluminium 7075 sheet was determined. The combination of finite element method and Taguchi analysis was used to determine the influence of process parameters. Simulations were carried out as per orthogonal array using DEFORM 2D software. Based on the predicted deformation of deep drawn cup and analysis of variance test (Anova), it was observed that blank temperature has greatest influence on the formability of aluminium material followed by punch velocity and die arc radius. Multiple regression analysis techniques were applied in modelling the behaviour of AA 7075 aluminium alloy under multistep deformation conditions.

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“…Increased strain hardening in a specimen containing a higher proportion of CSLs was observed after high-temperature deformation. [27] Nanocrystalline copper containing a high density of twins showed a tensile strength an order of magnitude higher than coarse-grained copper, due to the blockage of dislocation motion by the numerous twin boundaries. [28] It should also be noted that the role of twins can be more complex than impeding dislocation transmission.…”

Section: Discussionmentioning

confidence: 99%

Changes in Interface Parameters and Tensile Properties in Copper as a Consequence of Iterative Processing

Coleman

Randlè

2008

Metall Mater Trans A

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Both one-step and subsequent multistep grain boundary engineering processing of copper have been investigated. Specimens were tensile tested to failure after each stage of processing, and the microhardness was measured. These properties were linked to measurements of both the grain boundary misorientation and grain boundary plane distribution in order to provide insight into the mechanisms of microstructure evolution. Analysis of the stress-strain behavior revealed the balance between deformation and microstructure restoration occurring during processing. An increase in work hardening and a reduction in ductility were observed with successive processing iterations, indicating an accumulation of retained strain. This brought about stagnation in the microstructure, whereby no new R3s were generated and grain boundary migration was stabilized. It was shown that R3 boundaries are effective agents for dislocation pileup, and this strainretention ability plays an important role in the early stages of iterative processing. Analysis of the data in terms of ''incorporated'' and ''nonincorporated'' R3s indicated that iterative treatments are mechanistically different from one-step treatments. It was also shown that the R9 and R27 boundaries added to the microstructure as a consequence of iterative processing were not ''special,'' because they were on irrational boundary planes.

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The effect of grain boundary character distribution on the high temperature deformation behavior of Ni–16Cr–9Fe alloys

Cited by 72 publications

References 32 publications

High-cycle fatigue of nickel-based superalloy ME3 at ambient and elevated temperatures: Role of grain-boundary engineering

High-cycle fatigue of nickel-based superalloy ME3 at ambient and elevated temperatures: Role of grain-boundary engineering

Influence of process parameters on the cup drawing of aluminium 7075 sheet

Changes in Interface Parameters and Tensile Properties in Copper as a Consequence of Iterative Processing

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