The effect of focused ion beam machining on residual stress and crack morphologies in alumina

3D analysis of crack morphologies in silicate glass using FIB tomography

“…12,13,24 A significant feature of the 3D FIB tomographic analysis of the cracks in glass is that the density of circumferential cracks observed on the surface of the sample (by SEM, Fig. 2) is higher that the crack density observed beneath the indentation site (Figs.…”

“…FIB tomography can be used to characterise in 3D highly localized surface damage such as from indents and scratches, [12][13][14] and FIB tomography is applied here for the first time to quantitatively analyse the 3D crack distribution in silicate glass.…”

“…24 The change of stress is both a function of the geometry of the FIB-sputtered trenches cut into the material, and their location with respect to the preexisting microstructure and residual stress state of the sample, for example proximity to the central residual plastic damage zone of an indent. 12,24 In alumina it has been observed that the removal of the highly stressed central residual plastic damage zone of the indent during FIB tomography results in a reduction in both the residual stress and observed crack density in the remaining material. 24 For the silicate glass indents examined here, only a very small number of cracks to relieve stress were observed in the 2D FIB cross-sections through the Vickers indents compared to alumina samples indented with the same applied load.…”

“…[12][13][14][15][16] The 3D FIB tomography method involves milling serial cross-sections through a surface by FIB, imaging each sequential 2D section (typically by secondary electrons (SE)), and then aligning the 2D images of the sectioned material to reconstruct the 3D microstructure using specialized software (e.g. IMOD, IDL or Amira).…”

Surface damage induced by FIB milling and imaging of biological samples is controllable

“…The FIB induced artifacts are described as morphological defects, crystal damage, uncontrolled Ga + implantation, amorphization, material redeposition, mixing of material, radiation damage, changes in surface geometry, and its electronic properties, etc. (Adams, 2006;Barber, 1993;Barna et al, 1999;Bever et al, 1992;Boxleitner et al, 2001;Brezna et al, 2003;Cairney and Munroe, 2003;Frey et al, 2003;Huang, 2004;Inkson et al, 2006;Ishitani et al, 1998Ishitani et al, , 2004McCaffrey et al, 2001;Nord et al, 2002;Perrey et al, 2004;Rajsiri et al, 2002;Reiner et al, 2004;Rubanov and Munroe, 2003Stanishevsky et al, 2002;Vetterli et al, 1995;Wang et al, 2005;Yabuuchi et al, 2004;Yu et al, 2006).…”