2019
DOI: 10.1016/j.jallcom.2018.12.229
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The effect of flake-like morphology on the coating properties of silver coated copper particles fabricated by electroless plating

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Cited by 55 publications
(21 citation statements)
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“…3) shows. Previous studies [17,42] have already shown that a mechanical mixture provides a good dispersion of nanoparticles in the organic powder, but the mechanical mixing with temperature used in this case can lead to better bonding.…”
Section: Characterization Of Organic Coatingsmentioning
confidence: 99%
“…3) shows. Previous studies [17,42] have already shown that a mechanical mixture provides a good dispersion of nanoparticles in the organic powder, but the mechanical mixing with temperature used in this case can lead to better bonding.…”
Section: Characterization Of Organic Coatingsmentioning
confidence: 99%
“…This technique is preferred to the electrolytic plating process owing to its lower cost, high efficiency, applicability independently of the shape of the powder, and a dense and uniform coating deposition [121][122][123][124] whose thickness depends on the powder morphology. Electroless plating has been used for coating powders in different fields [17,23,[122][123][124][125][126][127]. Li et al [122] observed that the powder surface became coarse and irregular; some coating clusters were detected, whose formation can be related to the high deposition rate.…”
Section: Powders Immersionmentioning
confidence: 99%
“…The One coating process through powder immersion involving the use of solutions is electroless plating [120]. This technique is preferred to the electrolytic plating process owing to its lower cost, high efficiency, applicability independently of the shape of the powder, and a dense and uniform coating deposition [121][122][123][124] whose thickness depends on the powder morphology. Electroless plating has been used for coating powders in different fields [17,23,[122][123][124][125][126][127].…”
Section: Powders Immersionmentioning
confidence: 99%
“…[6][7][8]10,11 Among them, the conductive fillers are mainly divided into metal series, carbon series, and partial composite materials. At present, the commonly used conductive fillers are mostly metals with low resistivity, such as silver (Ag), 12,13 copper (Cu), 14 gold (Au), and nickel (Ni) 15 and carbon-based materials, [16][17][18][19] among which silver-based ECAs are the most widely used. However, the high price of gold and silver has greatly increased the preparation cost of pure-Au or Ag based ECAs.…”
Section: Introductionmentioning
confidence: 99%