2011
DOI: 10.1063/1.3589746
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The Effect of Extrusion Ratio and Material Flow on the Mechanical Properties of Aluminum Profiles Solid State Recycled from 6060 Aluminum Alloy Chips

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Cited by 24 publications
(20 citation statements)
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“…As stated in the previous investigation, small extrusion ratio was not sufficient to obtain high quality SSR samples without any cracks, voids, and porosity [10,24,31]. Therefore, in order to improve SSR samples properties obtained with small extrusion ratio, ECAP process was performed.…”
Section: Combination Of Ecap Process and Heat Treatmentmentioning
confidence: 94%
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“…As stated in the previous investigation, small extrusion ratio was not sufficient to obtain high quality SSR samples without any cracks, voids, and porosity [10,24,31]. Therefore, in order to improve SSR samples properties obtained with small extrusion ratio, ECAP process was performed.…”
Section: Combination Of Ecap Process and Heat Treatmentmentioning
confidence: 94%
“…In this case SPD contributed not only for grain refinement, but also for additional fracture and refinement of the oxide layers between aluminum chips. Fracture of the oxide layers and their homogeneous distribution inside recycled sample are crucial for high quality SSR samples production [31]. The diameter of the ECAP tool channel used in this work was 15.1 mm.…”
Section: Combination Of Ecap Process and Heat Treatmentmentioning
confidence: 99%
“…Re-melting is a well-know method for processing Al scrap [4]. Re-melting reduces the energy consumption for the whole process of Al production, but due to the high affinity of Al to oxygen, re-melting also leads to significant material losses through the oxidation process in a molten metal [5,6]. Due to the large specific surface, the material losses can grow in the process of re-melting Al chips.…”
Section: Introductionmentioning
confidence: 99%
“…A further increment in the fractional reduction of chips has a minimum effect on the overall mass wear and friction coefficient to the recycled chips based composites [36]. PT a (400, 2hrs) [42] PT(450, 20min) [60] PT(450, 2-30min) [53] PT(500, 50min) [23] PT(500, 2hrs) [35,41] PT(500 / 550) [20] / [10] PT(550, 15min) [22] PT(550, 3hrs) [61] PT(550, 6hrs) [11,14,37] ST b (550, 2hrs) [7] ST(650, 2hrs) [68] B: Forming Temperature (°C)…”
Section: Effects Of Chip Morphology Pre-molding and Lubrication Methodsmentioning
confidence: 99%
“…This is due to the thin oxidize layers on the scraps, completely broken into small pieces by high compressive and shear forces which stimulate the individual chip bonding [60]. Guley et al [61] in their study found that through the flat-face die, an ER of 10 did not guarantee a sufficient chip bonding. While at higher ER, the extruded profiles were found to gain superior strength and ductility.…”
Section: Effects Of Die Geometry and Extrusion Ratiomentioning
confidence: 98%