The effect of ethylenediamine tetramethylphosphonic acid on the chemical mechanical polishing of TSV barrier layer

Chen, Xuhua; Dong, Yanwei; Wang, Ru; Zheng, Tao; Du, Zhangjie; Huo, Jinxiang

doi:10.1016/j.colsurfa.2024.133469

Colloids and Surfaces A: Physicochemical and Engineering Aspect

2024

DOI: 10.1016/j.colsurfa.2024.133469

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The effect of ethylenediamine tetramethylphosphonic acid on the chemical mechanical polishing of TSV barrier layer

Xuhua Chen,

Yanwei Dong,

Ru Wang

et al.

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The effect of ethylenediamine tetramethylphosphonic acid on the chemical mechanical polishing of TSV barrier layer

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References 32 publications

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