2003
DOI: 10.1007/s11664-003-0054-x
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The effect of electron cyclotron resonance plasma parameters on the aspect ratio of trenches in HgCdTe

Abstract: Values of the aspect ratio for trenches etched into HgCdTe by an electron cyclotron resonance (ECR) plasma containing hydrogen and argon are limited by the phenomenon of etch lag. Modeling this plasma as an ion assisted, reactiveetching process leads to a set of conditions that greatly reduces etch lag. Use of these new process conditions produces trenches with aspect ratios greater than 3, widths less than 3 m, and depths in excess of 15 m.

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Cited by 31 publications
(36 citation statements)
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References 34 publications
(33 reference statements)
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“…This figure also shows data from ECR plasma processes from Ref. 20. As expected, higher RF-coupled DC biases lead to high aspect ratios for both ICP and ECR plasmas.…”
Section: Ion Angular Distributionsupporting
confidence: 71%
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“…This figure also shows data from ECR plasma processes from Ref. 20. As expected, higher RF-coupled DC biases lead to high aspect ratios for both ICP and ECR plasmas.…”
Section: Ion Angular Distributionsupporting
confidence: 71%
“…Again, ECR data is included from Ref. 20. Both ICP and ECR processes plasmas have similar ion angular dependence trends and both obey the night vision and electronic sensors directorate (NVESD) modified Jansen and Elwenspoek theory.…”
Section: Ion Angular Distributionmentioning
confidence: 99%
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“…HDP etching of HgCdTe using low energy Ar ion bombardment has a sputter component at high DC bias values and results in increased Hg removal 32 . The damage depth due to sputtering has been estimated to be <10 nm at operating bias voltage 33 . The properties of sidewall of the mesa may be different and are difficult to characterise.…”
Section: Co-lateral Damages/surface Effectsmentioning
confidence: 99%
“…[1][2][3][4][5][6][7][8][9][10][11][12][13][14] However, ICP plasma processing, used in HgCdTe, is still maturing and continued research is needed. 4,7,14 ICP plasma processing may also be used to replace conventional wet chemical clean-up, and even be used in the surface preparation for epitaxy of II-VI materials.…”
Section: Introductionmentioning
confidence: 99%