The effect of die attach voiding on the thermal resistance of chip level packages

Fleischer, Amy S.; Chang, Luke J.; Johnson, Barry C.

doi:10.1016/j.microrel.2005.01.019

Cited by 86 publications

(11 citation statements)

References 11 publications

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“…The traditional cohesive zone model has been used to analyze the effects of delamination propagation behavior on interface heat transfer and plays a key role in interface crack prediction [34]. Extensive research has also attempted to elucidate the relationship between the defects and reliability characteristics of electronic devices, including interface failure effects on reliability [35][36][37], void effects of DA layers in LED packages [38][39][40][41][42][43] and DC-to-DC converters [44]. The degradation of heat transfer performance is one of the main causes of electronic package failure; hence, several studies tried to characterize the mechanism behind the degradation of heat transfer performance from the perspective of energy loss [10,45].…”

Section: Entropy Methodologies For Microstructuresmentioning

confidence: 99%

Entropy Generation Methodology for Defect Analysis of Electronic and Mechanical Components—A Review

Cai

Cui

Qin

et al. 2020

Entropy

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Understanding the defect characterization of electronic and mechanical components is a crucial step in diagnosing component lifetime. Technologies for determining reliability, such as thermal modeling, cohesion modeling, statistical distribution, and entropy generation analysis, have been developed widely. Defect analysis based on the irreversibility entropy generation methodology is favorable for electronic and mechanical components because the second law of thermodynamics plays a unique role in the analysis of various damage assessment problems encountered in the engineering field. In recent years, numerical and theoretical studies involving entropy generation methodologies have been carried out to predict and diagnose the lifetime of electronic and mechanical components. This work aimed to review previous defect analysis studies that used entropy generation methodologies for electronic and mechanical components. The methodologies are classified into two categories, namely, damage analysis for electronic devices and defect diagnosis for mechanical components. Entropy generation formulations are also divided into two detailed derivations and are summarized and discussed by combining their applications. This work is expected to clarify the relationship among entropy generation methodologies, and benefit the research and development of reliable engineering components.

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Section: Entropy Methodologies For Microstructuresmentioning

confidence: 99%

Entropy Generation Methodology for Defect Analysis of Electronic and Mechanical Components—A Review

Cai

Cui

Qin

et al. 2020

Entropy

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“…The voids extend through the entire DA material. Because the thermal conductivity of void/air is extremely low (0.113∼0.026 W/mK), 16,17 only bonded areas were used to calculate the thermal resistance. As a result, the calculated area thermal resistance per unit thickness (R A/h , RA/h) of SAC305DN was 0.045 mK/W which was 47.87% of SAC305, 26.47% of Ag-P and only 7.89% of Ag-S as shown in Table I.…”

Section: Resultsmentioning

confidence: 99%

Reducing the Thermal Resistance of LED Die-Attach Material Using Ni-Coated Diamond Mixed with Sn-3 wt%Ag-0.5 wt%Cu Solder

Chang

Chen

et al. 2015

ECS J. Solid State Sci. Technol.

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High thermal resistance of LED die-attached (DA) material degraded LED's performance. To reduce the DA material resistance, three kinds of diamond particles were used to mix with Sn-3wt%Ag-0.5wt%Cu solder (SAC305) solder. It was found that neither bare diamond particle nor Ti-coated diamond particle could be used. On the other hand, the thermal resistance was reduced by using Ni-coated diamond particle with SAC305.

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“…Fleischer et al 25 discuss the effect of die attach voiding on the thermal resistance of chip level packages. Such voids are easily formed in the solder layer during manufacturing, and are found to nucleate, grow and coalesce with thermal cycling.…”

Section: The Problem Of Non-linearitymentioning

confidence: 99%

Fundamentals of Electronic Component Thermal Resistance

Lasance

Sabry

Bar‐Cohen

2014

Encyclopedia of Thermal Packaging

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The effect of die attach voiding on the thermal resistance of chip level packages

Cited by 86 publications

References 11 publications

Entropy Generation Methodology for Defect Analysis of Electronic and Mechanical Components—A Review

Entropy Generation Methodology for Defect Analysis of Electronic and Mechanical Components—A Review

Reducing the Thermal Resistance of LED Die-Attach Material Using Ni-Coated Diamond Mixed with Sn-3 wt%Ag-0.5 wt%Cu Solder

Fundamentals of Electronic Component Thermal Resistance

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