The effect of cyclic hardening in copper heat-sinks on die fracture probability

Bielen, J.A.; Gils, Mark van; Theunis, F.

doi:10.1109/esime.2005.1502816

Cited by 4 publications

(3 citation statements)

References 12 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…However, cyclic hardening or weakening was not taken into account for fatigue, since these parameters were not measured. It is also possible for the material behaviour to change during fatigue, as already observed in cubic face-centred copper under cyclic loading (Bielen et al, 2005).…”

Section: Discussionmentioning

confidence: 91%

Developing a model for the bond heel lifetime prediction of thick aluminium wire bonds

Merkle

Sonner

Petzold

2012

Soldering &Amp; Surface Mount Technology

View full text Add to dashboard Cite

Purpose - The purpose of this paper is to establish a law on the durability of thick aluminium wire bonds in low cycle fatigue for different geometries and wire diameters under a purely mechanical load. Design/methodology/approach - Bond wires with different geometries were tested with various loads and a mechanical test bench, and their endurance was determined. The same load situation was modelled with finite element analysis and then compared against the experimental results. Findings - A correlation was found between the plastic strain per cycle and the determined lifespan. Therefore, the lifespan can be calculated by mechanical-plastic simulation for various loop geometries and loading cases. Practical implications - The loop height strongly influences the durability of the wire bond, whereas other parameters, such as the loop angle, have a weaker influence on the bond heel lifetime. Originality/value - The mechanical simulation is able to replace the time-consumin g lifetime experiments

show abstract

Section: Discussionmentioning

confidence: 91%

Developing a model for the bond heel lifetime prediction of thick aluminium wire bonds

Merkle

Sonner

Petzold

2012

Soldering &Amp; Surface Mount Technology

View full text Add to dashboard Cite

show abstract

“…A probabilistic approach is needed to describe the statistical behavior. Weibull theory has been successfully applied to model the fracture failure probability of Silicon chips [4,5,6,7]. The failure probability p can be described with following equation [7]:…”

Section: Figure 1: Test Methods For Die Strength Measurements; (A) Tmentioning

confidence: 99%

Die fracture probability prediction and design guidelines for laminate-based over-molded packages

Yang

Bielen

Theunis

et al. 2008

EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronic

Self Cite

View full text Add to dashboard Cite

Transferring molding process is widely used in the plastic IC packaging. Die cracking failures due to transfer molding process may occur. In this paper, an investigation on the die fracture and its failure probability is conducted. The approaches and results of die strength characterization, FE modeling on the laminate-based packages, and simulation-based prediction of the die fracture probability rate are presented. Weibull statistics model was used to describe the probability distribution. Model parameters were obtained by fitting to the test results. 3D parametric FE models were established to conduct numerical simulations to predict the stress field and die fracture probability caused during the transfer molding process. For a BGA package, the influence of the solder mask opening under the die on the fracture probability was investigated. For the capped MEMS, high stress levels are induced in the cap and the MEMS die during the molding process. The cavity size, cap thickness, the molding pressure, and the wafer surface finishing process have significant influences on the fracture failure probability. It shows that improvement of die fracture probability can be achieved by changing the designs or the die surface finishing process to meet the reliability requirements.

show abstract

“…In order to take into account non-uniform stress distributions and the probabilistic nature of surface defects that determine the fracture strength of the cap and the die, Weibull statistics and a surface area stress integral have been used to calculate the probability of cap and MEMS die fracture. An analogous approach as described in [3] has been used except that in this study the surface strength was characterized with ball-on-ring measurements.…”

Section: Opening Of Bond Pad Area's In Combination With Thinning Of Wmentioning

confidence: 99%

A Novel And Efficient Packaging Technology For RF-MEMS Devices

Theunis

Lisec

Reinert

et al. 2007

2007 Proceedings 57th Electronic Components and Technology Conference

Self Cite

View full text Add to dashboard Cite

RF MEMS technology shows great promise for wireless communication and other RF applications. However, the packaging of RF MEMS devices becomes one of the most important issues in MEMS device fabrication and presents challenges due to the unique requirements. Special precautions are not only required to allow assembly processes after releasing the delicate structures but also to ensure the structures to operate in a stable atmosphere during its entire lifetime. These requirements come on top of the other wellknown requirements for cell phone components: cost, size and height. NXP Semiconductors has developed an efficient packaging technology for RF-MEMS devices in close cooperation with the Fraunhofer Institute in Itzehoe (ISiT). This paper presents a summary of several major aspects of our development activities in order to generate this new packaging technology.

show abstract

The effect of cyclic hardening in copper heat-sinks on die fracture probability

Cited by 4 publications

References 12 publications

Developing a model for the bond heel lifetime prediction of thick aluminium wire bonds

Developing a model for the bond heel lifetime prediction of thick aluminium wire bonds

Die fracture probability prediction and design guidelines for laminate-based over-molded packages

A Novel And Efficient Packaging Technology For RF-MEMS Devices

Contact Info

Product

Resources

About