Abstract:Current thermal interface materials including solders, greases, and phase change materials do not have the mechanical compliance required to fill cavities, and thermal conductance necessary to dissipate heat generated in modern microelectronic devices.The inability to dissipate heat properly from the microprocessor device creates a thermal bottleneck which limits device efficiency and leads to early life degradation. Individual The most widely available and cost effective means of producing carbon nanotubes ar… Show more
Set email alert for when this publication receives citations?
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.