DOI: 10.18130/v3w90g
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The Effect of Catalyst Sublimation Temperature on the Purity of Multi-Walled Carbon Nanotube Vertically Aligned Arrays

Abstract: Current thermal interface materials including solders, greases, and phase change materials do not have the mechanical compliance required to fill cavities, and thermal conductance necessary to dissipate heat generated in modern microelectronic devices.The inability to dissipate heat properly from the microprocessor device creates a thermal bottleneck which limits device efficiency and leads to early life degradation. Individual The most widely available and cost effective means of producing carbon nanotubes ar… Show more

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