The Effect of Bi Concentration on Wettability of Cu Substrate by Sn-Bi Solders

Lee, Chang‐Bae; Jung, Seung‐Boo; Shin, Young-Eui; Shur, Chang-Chae

doi:10.2320/matertrans.42.751

Cited by 62 publications

(36 citation statements)

References 7 publications

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“…However, because Pb will induce environment pollution, Pb free solders such as Sn-Bi, Sn-Ag, Sn-Zn alloys, have been considered to replace SnPb solders. [1][2][3] Sn-Bi, Sn-Ag and Sn-Zn eutectic and near eutectic alloys are already used in some applications for the specific advantages, and they offer over eutectic Sn-Pb, such as lower process temperatures, compatibility with particular substrates, or superior reliability under certain conditions. 4) Especially, the Sn-58Bi eutectic solder is a low melting point lead free solder developed for step soldering processes.…”

Section: Introductionmentioning

confidence: 99%

Interfacial Reactions Between Sn-58 mass%Bi Eutectic Solder and (Cu, Electroless Ni-P/Cu) Substrate

2002

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The growth kinetics of intermetallic compound layers formed between eutectic Sn-58Bi solder and (Cu, electroless Ni-P/Cu) substrate were investigated at temperature between 70 and 120 • C for 1 to 60 days. The layer growth of intermetallic compound in the couple of the Sn-58Bi/Cu and Sn-58Bi/electroless Ni-P system satisfied the parabolic law at given temperature range. As a whole, because the values of time exponent (n) have approximately 0.5, the layer growth of the intermetallic compound was mainly controlled by diffusion mechanism over the temperature range studied. The apparent activation energies of Cu 6 Sn 5 and Ni 3 Sn 4 intermetallic compound in the couple of the Sn-58Bi/Cu and Sn-58Bi/electroless Ni-P were 127.9 and 81.6 kJ/mol, respectively.

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Section: Introductionmentioning

confidence: 99%

Interfacial Reactions Between Sn-58 mass%Bi Eutectic Solder and (Cu, Electroless Ni-P/Cu) Substrate

2002

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“…Gold is plated on the Ni surface of the ball pads not only to improve the wettability, but also to increase the resistance to corrosion. 9,10) Alternative solder alloys are needed to meet environmental regulations, requirements for greater mechanical reliability, and higher temperature service environments in automobiles and in avionics systems. 11,12) Especially, the Sn-Ag and SnAg-Cu alloys are regarded as having the most potential as lead free solder systems.…”

Section: Introductionmentioning

confidence: 99%

Effect of Isothermal Aging on Ball Shear Strength in BGA Joints with Sn-3.5Ag-0.75Cu Solder

et al. 2002

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The ball shear strength of BGA solder joints during isothermal aging was studied with Sn-3.5Ag-0.75Cu solder on three different pads (Cu, electroless Ni-P/Cu, immersion Au/Ni-P/Cu) at temperature between 70 and 170 • C for times ranging from 1 to 100 days. The reliability of solder ball attachment was characterized by mechanical ball shear tests. As a whole, the shear strength of BGA joints decreased with increasing temperature and time. The shear strength for both the immersion Au/Ni-P/Cu and electroless Ni-P/Cu pads was consistently higher than that of the Cu pad for all isothermal aging conditions. The fracture surface showed various characteristics depending on aging temperature, time, and the types of BGA pad. The P-rich Ni layer formed at the interface between (Cu, Ni) 6 Sn 5 and Ni-P deposits layer after aging, but fracture at this interface was not the dominant site for immersion Au/Ni-P/Cu and electroless Ni-P/Cu pad.

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“…[7][8][9] The Sn-9Zn and Sn-3.5Ag are the two important binary lead-free solders investigated, 10,11) but inferior wettability and oxidation resistance of the Sn-9Zn alloy and high melting point (221 C) of the Sn-3.5Ag alloy, limit the usage of these solder alloys. [12][13][14][15] Chen et al 16) have determined the melting and solidification characteristics of various solder alloys using DSC.…”

Section: Introductionmentioning

confidence: 99%

Thermal Characteristics and Intermetallic Compounds Formed at Sn-9Zn-0.5Ag/Cu Interface

Chang

Hon

Wang³

2004

Mater. Trans.

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The thermal characteristics of various Sn-based solder alloys and intermetallic compounds (IMCs) formed at the Sn-9Zn-0.5Ag/Cu interface have been investigated by using differential scanning calorimetry, X-ray diffractometry, scanning electron microscopy, energy dispersive spectrometry, transmission electron microscopy and electron diffraction. The melting ranges of the Sn-37Pb, Sn-9Zn and Sn-3.5Ag alloys are 179:5$191:0, 195:5$208:1 and 220:4$227:8 C, and the heats of fusion are 104.2, 163.9 and 151.0 J/g, respectively. When 0.5 mass% Ag is added to the Sn-9Zn alloy, the melting temperature of the solder alloy increases from 195.5 to 196.7 C, but the melting range and heat of fusion decrease from 12.6 to 11.3 C and 163.9 to 74.7 J/g, respectively. The IMCs formed at the Sn-9Zn-0.5Ag/Cu interface are determined as a scallop-shaped Cu 6 Sn 5 near the solder alloy, a flat Cu 5 Zn 8 close to the Cu substrate and Ag 3 Sn particles between the Cu substrate and Cu 5 Zn 8 layer. The Cu 6 Sn 5 is bi-structural, namely, hexagonal and monoclinic, which is caused by the Ag dissolution in the Cu 6 Sn 5 layer.

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The Effect of Bi Concentration on Wettability of Cu Substrate by Sn-Bi Solders

Cited by 62 publications

References 7 publications

Interfacial Reactions Between Sn-58 mass%Bi Eutectic Solder and (Cu, Electroless Ni-P/Cu) Substrate

Interfacial Reactions Between Sn-58 mass%Bi Eutectic Solder and (Cu, Electroless Ni-P/Cu) Substrate

Effect of Isothermal Aging on Ball Shear Strength in BGA Joints with Sn-3.5Ag-0.75Cu Solder

Thermal Characteristics and Intermetallic Compounds Formed at Sn-9Zn-0.5Ag/Cu Interface

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