2009
DOI: 10.1039/b813757a
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The effect of adhesion promoter on the adhesion of PDMS to different substrate materials

Abstract: The effect of the adhesion promoter GE SS4120 on the adhesion strength of PDMS to different substrates was tested. The adhesion to silicon, glass and aluminium was significantly increased, while adhesion of PDMS to Teflon remained poor, and the adhesion strength of PDMS to PDMS decreased.

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Cited by 43 publications
(20 citation statements)
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References 6 publications
(8 reference statements)
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“…Often a stronger adhesion is needed for which a promoter can be used to increase the adhesion of PDMS to silicon, glass and aluminum. [ 99 ] In some cases, such as microfl uidic devices using high pressures in valves and pumps, surfaces are bonded irreversibly. PMMA and COC substrates are bonded at …”
Section: Packagingmentioning
confidence: 99%
“…Often a stronger adhesion is needed for which a promoter can be used to increase the adhesion of PDMS to silicon, glass and aluminum. [ 99 ] In some cases, such as microfl uidic devices using high pressures in valves and pumps, surfaces are bonded irreversibly. PMMA and COC substrates are bonded at …”
Section: Packagingmentioning
confidence: 99%
“…This increase is also partly attributed to loss of a small percentage of Al lines during the transfer into PDMS. This loss can be mitigated through incorporation of an adhesion promoter such as, GE SS4120, at the Al/PDMS interface as demonstrated by . Figure (b) and (c) show the visual performance of the flexible, gas permeable and biocompatible NWGP for TM and TE polarizations respectively.…”
Section: Wire Grid Releasementioning
confidence: 99%
“…A common procedure involves surface treatment techniques such as plasma oxidation to enhance bond strength. [10][11][12] However, such surface treatments remain stable in air for only a short time (a few minutes in our experience), creating a strict time constraint to align and attach a PDMS part to a substrate once the PDMS part is removed from the plasma etching tool. 9 Use of an intermediate layer is an alternate approach to facilitate bonding between two materials.…”
Section: Introductionmentioning
confidence: 99%
“…9 Use of an intermediate layer is an alternate approach to facilitate bonding between two materials. 12,13 For instance, ultraviolet (UV) curable adhesive has been used as an intermediate layer between substrates, such as glass and silicon as reported in Ref. 13.…”
Section: Introductionmentioning
confidence: 99%
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