The Effect of Adhesion on Indentation Behavior of Various Smart Materials

Abstract

The nanoindentation technique plays a significant role in characterizing the mechanical properties of materials at nanoscale, where the adhesion effect becomes very prominent due to the high surface-to-volume ratio. For this paper, the classical adhesion theories were generalized to study the contact behaviors of various piezoelectric materials indented by conical punches with different electric properties. With the use of the Hankel integral transform, dual integral equations, and superposing principle, the closed-form solutions of the physical fields for the Johnson-Kendall-Roberts (JKR) and Maugis-Dugdale (M-D) models were obtained, respectively. The contribution of the electrical energy to the energy release rate under the conducting punch was taken into consideration. The relationships between the contact radius, the indentation load, and the indentation depth were set up using the total energy method for the JKR model and the Griffith energy balance for the M-D model, respectively. Numerical results indicate that increasing the half cone angle of the conical punch enhances the adhesion effect, which can significantly affect the accuracy of the results of characterization in nanoindentation tests. It was found that the effect of electric potential on adhesion behaviors is sensitive to different material properties, which are not revealed in the existing studies of axisymmetric adhesive contact of piezoelectric materials and multiferroic composite materials. The load-displacement curves under conical punches with different half cone angles have very different slopes. These results indicate that the half cone angle has a prominent effect on the characterization of mechanical properties of piezoelectric solids in nanoindentation tests.