1997
DOI: 10.1016/s0924-4247(97)80298-1
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The effect of additives on the adsorption properties of porous silicon

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Cited by 52 publications
(24 citation statements)
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“…Previously the interaction of both oxidized and nonoxidized porSi layers with ionic surfactants was studied. [6][7][8][9][10][11][12] An addition of surfactants to the electrochemical etch bath during the preparation of porSi has been found to modify the etch morphology and photoluminescence properties of the material.…”
mentioning
confidence: 99%
“…Previously the interaction of both oxidized and nonoxidized porSi layers with ionic surfactants was studied. [6][7][8][9][10][11][12] An addition of surfactants to the electrochemical etch bath during the preparation of porSi has been found to modify the etch morphology and photoluminescence properties of the material.…”
mentioning
confidence: 99%
“…PL spectra corresponding to samples prepared in each solution with the same anodization conditions, current density (56.5 mA cm -2 ), anodization time (10 min) and resistivity [1][2][3][4][5][6][7][8][9][10][11][12][13][14][15][16][17][18][19][20] cm, are shown in Figure 3. PL spectrum for sample produced from HF-MeCN solution presented a blue shift peak that may depend on the pore depth and diameter.…”
Section: Resultsmentioning
confidence: 99%
“…The surface tension reduction promotes two effects of reducing the size of the hydrogen bubbles, and of allowing the formed bubbles to escape more easily from the solution, favoring the PS layer formation. 5,[14][15][16] Considering all these aspects, the goal of this work is to present the study and discuss the anodization parameter influences on the formed PS macroporous layer. Comparing the colossal publication found in the literature on PS subjects, few reports are dedicated to PS formation from MeCN additive.…”
Section: Introductionmentioning
confidence: 99%
“…Indeed, hydrogen is produced during the etching process, and the coalescence of bubbles can lead to morphology inhomogeneity. 9,10 In this review, the description of PS etching will be restricted to aqueous HF electrolytes. For etching processes in organic solutions, one can see Ref.…”
Section: General Description and Etching Principlesmentioning
confidence: 99%