2015 IEEE 42nd Photovoltaic Specialist Conference (PVSC) 2015
DOI: 10.1109/pvsc.2015.7356441
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The effect of a post-activation annealing treatment on thin film cdte device performance

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Cited by 20 publications
(14 citation statements)
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“…This is also observed in CdSeTe/CdTe device performance as demonstrated in this study. This is understood to be due to Cl passivating the grain boundaries and this is associated with the removal of planar defects [19]. High densities of stacking faults observed in the as deposited material are completely removed.…”
Section: Summary Of Electrical Performance Of As Deposited Cdsete/cdtmentioning
confidence: 99%
“…This is also observed in CdSeTe/CdTe device performance as demonstrated in this study. This is understood to be due to Cl passivating the grain boundaries and this is associated with the removal of planar defects [19]. High densities of stacking faults observed in the as deposited material are completely removed.…”
Section: Summary Of Electrical Performance Of As Deposited Cdsete/cdtmentioning
confidence: 99%
“…At 390 C, chlorine and oxygen signatures are present at the grain boundaries. A chlorine signature along the grain boundaries is typical for CdTe passivation, 20 but the strong corresponding oxygen signal is atypical. At 420 C, no significant change in the chlorine signature was observed, but large voids begin to form near select grain boundaries with corresponding oxygen signals.…”
Section: Identifying Loss Locationmentioning
confidence: 99%
“…In CdTe chloride passivation, it has been theorized that chlorine travels down the grain boundaries in an elemental state and preferentially accumulates there. 20,32 The chlorine can remove stacking faults from within the CdTe grains and may passivate the grain boundaries by filling tellurium vacancies, effectively making the grain boundaries less p-type. 23 This can affect both transport and recombination.…”
Section: Identifying Loss Locationmentioning
confidence: 99%
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