The Effect Addition of (Silicon and Silver) and Heat Treatments to the Alloy Properties (Copper - Nickel - Tin)

Abstract

Copper-Nickel-Tin alloys have been recently developed by Hardening due to spinodal decomposition. The (Cu - 9Ni - 6Sn) system has shown promise in this direction and has been used to develop several high strength compositions. It is well known the fact that small element additions significantly modify phase transformation characteristics, the effect of adding Silicon or Silver on the Spinodal hardening in (Cu - 9Ni - 6Sn) alloy was studies close to the Spinodal cusp temperature. The presence of Silver also increased the ductility of alloy at the expense of some hardness. The effects of trace elements additions have been observed in this work with a view to improve high strength alloys as substitutes to the Copper – Beryllium alloys. The results obtained from the current research proved that adding a small amount of alloying elements with a percentage (1%) of silicon or silver to the base alloy (Cu - 9% Ni - 6% Sn), led to the stability of the mechanical properties resulting from the stability of the microstructure due to Heat treatment for hardening (Spinodal decomposition).