1981
DOI: 10.1016/0040-6090(81)90699-4
|View full text |Cite
|
Sign up to set email alerts
|

The dynamics of reactive ion sputtering of SnSb and InSn alloys in an ArO2 atmosphere

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1
1
1
1

Citation Types

0
4
0

Year Published

1983
1983
2016
2016

Publication Types

Select...
6
1

Relationship

0
7

Authors

Journals

citations
Cited by 25 publications
(4 citation statements)
references
References 4 publications
0
4
0
Order By: Relevance
“…At a given rf power, the thermalizatoin region shifts toward the target by increasing O 2 partial pressure. 22 This result leads to the oxidation of the target 23,24 and possible resputtering of the film 25 and created the decreased deposition rate of the BS x T 1−x thin films.…”
Section: Crystal Structure and Chemical Composition Of The Bs X T 1−xmentioning
confidence: 98%
“…At a given rf power, the thermalizatoin region shifts toward the target by increasing O 2 partial pressure. 22 This result leads to the oxidation of the target 23,24 and possible resputtering of the film 25 and created the decreased deposition rate of the BS x T 1−x thin films.…”
Section: Crystal Structure and Chemical Composition Of The Bs X T 1−xmentioning
confidence: 98%
“…37 It should be noted that at higher carrier electron-electron and electron-impurity scattering result in a downward shift of the conduction band and upward shift of the valence band and consequently band gap narrowing. Therefore, considering both band gap widening and narrowing effect, the effective band gap can be expressed by 36 :…”
Section: Evaluation Of Band Gap Energymentioning
confidence: 99%
“…At a given rf power, the thermalization region shifts toward the target by increasing O 2 partial pressure. [102] This leads to the oxidation of the target [103,104] and possible re-sputtering of the film [105] and created the decreased deposition rate of the SBT thin film.…”
Section: Effect Of Argon-to-oxygen Ratio On Structural Propertiesmentioning
confidence: 99%
“…This reduces the deposition rate of film. Furthermore, at a given rf power density of 2.3W/cm 2 , the thermalization region shifts toward the target by increasing O 2 partial pressure [102] , leading to the oxidation of the target [103,104] and possible re-sputtering of the film [105] that would compound the decrease in the deposition rate. RTA) deposited at various oxygen partial pressures, indexed by assuming an orthorhombic cell (a=5.531Å, b=5.534Å, and c=24.98Å [8] ).…”
Section: Deposition Ratementioning
confidence: 99%