The Dipole Radiating Integrated Module: Experimental Results

All‐pass phaser on a base of half‐wave coupled‐line section and its application

“…The proposed phaser was then used to create the 4‐beam dipole array in its classical structural configuration and PCB realization. Namely, the center‐fed dipole radiators were realized according to the approach described in Reference 16. The radiating halves of all the four dipoles were manufactured on the thin film central board G that was used to realize the Butler matrix.…”

“…The radiating halves of all the four dipoles were manufactured on the thin film central board G that was used to realize the Butler matrix. The four dovetail fragments of the necessarily baluns, proposed in Reference 16, are realized on the bottom side of the thick sheet G1, the top side of which has no copper clothe. This sheet G1 is placed in the appropriate metallic mounting box so that its printed copper clothe (on the bottom side) adjoins closely to the top plane of low metallic ground plate inside the box.…”

“…The second thick board G2 without copper clothes is placed above the board G in the top part inside the box in order to cover only the topology of Butler matrix. In order to maintain the conditions and restrictions proposed in Reference 16 both the sheets G and G1 are closely paste to each other by using the corresponding lossless glue (Figure 4). This Figure displays also the numbering = 1, 2, 3, 4 each of the four inputs of the array.…”

“…Then, the thin film board G with both the printed copper patterns, those were previously realized on its sides, is placed so that the radiating halves of the center-fed dipoles should be placed above the sheet G1 in accordance with the above-mentioned approach. 16 The second thick board G2 without copper clothes is placed above the board G in the top part inside the box in order to cover only the topology of Butler matrix. In order to maintain the conditions and restrictions proposed in Reference 16 both the sheets G and G1 are closely paste to each other by using the corresponding lossless glue (Figure 4).…”