The development and investigation of highly stretchable conductive inks for 3-dimensional printed in-mold electronics

Lee, Sang Yoon; Jang, Seong Hyun; Lee, Hyun Kyung; Kim, Jongsun; Lee, Sangkug; Song, Ho Jun; Jung, Jae Woong; Yoo, Eui Sang; Choi, Jun

doi:10.1016/j.orgel.2020.105881

Cited by 18 publications

(9 citation statements)

References 24 publications

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“…Specific mechanical properties similar to solids remain unchanged. In 2020, Sang Yoon Lee et al [ 13 ] studied highly ductile conductive inks for three-dimensional in-mold electronics technology, which realizes injection molding and installation of electronic circuits and optical devices through a one-step process, and after the stretchable conductive ink formulation is formed, accurately screen prints circuit patterns and performs a one-step injection molding process. After the high-temperature and high-pressure in-mold electronic process, the conductive filler of the ink circuit is tightly filled, resulting in a significant increase in its conductivity.…”

Section: Literature Reviewsmentioning

confidence: 99%

Non-Dominant Genetic Algorithm for Multi-Objective Optimization Design of Unmanned Aerial Vehicle Shell Process

et al. 2022

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This paper uses Pareto-optimized frames and injection molding process parameters to optimize the quality of UAV housing parts with multi-objective optimization. Process parameters, such as melt temperature, filling time, pressure, and pressure time, were studied as model variables. The quality of a plastic part is determined by two defect parameters, warpage value and mold index, which require minimal defect parameters. This paper proposes a three-stage optimization system. In the first stage, the main node position of the electronic chip in the module is collected by the unified sampling method, and the chip calculation index of these node positions is analyzed by the mold flow analysis software. In the second stage, the kriging function predicts the mathematical relationship between the mold index and warpage value and the process parameters, such as melt temperature, filling time, packing pressure, and packing time. In the third stage, using LHD sampling and non-dominant rank genetic algorithm II, a convergence curve of warp value is found near the Pareto optimal frontier. In the fourth stage, the fitting degree of Pareto optimal leading edge curve points was verified by analytical experiments. According to experimental verification, it can be seen that the injection molding factors are pressure and pressure time, because the injection molding time and pressure time are completely positively correlated with the mold indicators, the correlation is the strongest, the mold temperature and glue temperature are not the main influencing factors, and the mold temperature shows a certain degree of negative correlation. In this experiment, the die index is mainly improved by injection time and pressure, optimal injection parameter factor combination and minimum injection index, the optimization rate of the die index is up to 96.2% through genetic algorithm optimization nodes and experimental verification, the average optimization rate of the four main optimization nodes is 91.2%, and the error rate with the actual situation is only 8.48%, which is in line with the needs of actual production, and the improvement of the UAV IME membrane is realized.

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Section: Literature Reviewsmentioning

confidence: 99%

Non-Dominant Genetic Algorithm for Multi-Objective Optimization Design of Unmanned Aerial Vehicle Shell Process

et al. 2022

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“…Yang et al 2018). Similarly, by combining the in-mold decoration technique and 3D printed electronics, in-mold electronics was also widely adopted by industries for manufacturing functional electronics (Lee et al 2020).…”

Section: Printing Electronicsmentioning

confidence: 99%

Computational Design for Digitally Fabricated 3D Inductive Power Transfer Coils

Doubrovski

Geraedts

et al. 2022

Journal of Computing and Information Science in Engineering

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The geometric shapes and the relative position of coils influence the performance of a three-dimensional (3D) inductive power transfer system. In this paper, we propose a coil design method for specifying the positions and the shapes of a pair of coils to transmit the desired power in 3D. Given region of interests (ROIs) for designing the transmitter and the receiver coils on two surfaces, the transmitter coil is generated around the center of its ROI first. The center of the receiver coil is estimated as a random seed position in the corresponding 3D surface. At this position, we use the heatmap method with electromagnetic constraints to iteratively extend the coil until the desired power can be transferred via the set of coils. In each step, the shape of the extension, i.e. a new turn of the receiver coil, is found as a spiral curve based on the convex hulls of adjacent turns in the 2D projection plane along their normal direction. Then, the optimal position of the receiver coil is found by maximizing the efficiency of the system. In the next step, the position and the shape of the transmitter coil are optimized based on the fixed receiver coil using the same method. This zig-zag optimization process iterates until an optimum is reached. Simulations and experiments with digitally fabricated prototypes were conducted and the effectiveness of the proposed 3D coil design method was verified. Possible future research directions are highlighted well.

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“…Finally, experimental images of multiobjective optimization results in line with actual production requirements are provided under four injection-molding influence parameters. In 2020, Sang YoonLee et al [ 17 ] studied the highly ductile conductive ink of the three-dimensional in-mold electronic technology IME, and the results achieved the injection and installation of electronic circuits and optical devices; after forming a tensile conductive ink, it could precisely display printed circuit patterns and optimize the injection-molding process. After high temperature and high pressure, the ink filler is tightly filled, resulting in a significant improvement in the conductivity of the ink.…”

Section: Literature Reviewsmentioning

confidence: 99%

A Node Detection Method Based on Johnson–Cook and Thin-Film IMD Characteristic Model Armor Damage Detection Repair and Subsequent Optimization

et al. 2022

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In this paper, a node detection method is proposed for the detection of battle damage to armor. This experiment uses the special nature of the film to virtualize the surface of the armor IMD film coverage. The die index is a large area and is easy to damage, but with the use of a unique IMD film stamping die, the possibility of damage decreases, which provides a damage prediction function for the armor. In addition, for the damaged armor, the same method can be used to detect because the damaged part more easily causes the surface film to rupture after being impacted, so it is possible to optimize the design of the armor and the molding through the die index. The die index can also detect the degree of damage to the damaged part of the damaged armor. Therefore, the IMD die index is introduced to quantify the data, and the degree of damage is judged by the IMD die index. The novelty of this work is that each node can efficiently detect the vulnerable damage position of the armor using the die index and then pass through the COMSOL. The Johnson–Cook stress model simulates the battle loss, obtains the stress deformation that occurs after the battle loss, and verifies the experiment by comparing the results obtained. Finally, the repair method is used to repair all the predicted battle damage parts based on additive manufacturing to ensure that they can be used again after repair.

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The development and investigation of highly stretchable conductive inks for 3-dimensional printed in-mold electronics

Cited by 18 publications

References 24 publications

Non-Dominant Genetic Algorithm for Multi-Objective Optimization Design of Unmanned Aerial Vehicle Shell Process

Non-Dominant Genetic Algorithm for Multi-Objective Optimization Design of Unmanned Aerial Vehicle Shell Process

Computational Design for Digitally Fabricated 3D Inductive Power Transfer Coils

A Node Detection Method Based on Johnson–Cook and Thin-Film IMD Characteristic Model Armor Damage Detection Repair and Subsequent Optimization

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