The deformation behavior and fracture toughness of single crystal YSZ(111) by indentation

Study on Damage of 4H-SiC Single Crystal through Indentation and Scratch Testing in Micro–Nano Scales

“…Zhang et al [10] conducted scratching experiments to investigate the influence of heat on material removal and friction behaviors of reaction bonded SiC ceramics under different temperatures. Jian et al [11] carried out a combination of micro-and nanoindentation techniques to investigate the indentation-induced pop-in effect and fracture behaviors in yttrium-stabilized zirconia(111) single crystals. Gao et al [12] established an analytical model of an elastic stress field for brittle material during single abrasive scratching based on elasticity and indentation fracture mechanics.…”

Nanoindentation of Bi2Se3 Thin Films

“…Thus, studies on the correlations between the microstructural and mechanical properties of thin films are indispensable. Nanoindentation has been widely used as a powerful depth-sensing probe for measuring the primary mechanical property parameters, such as hardness and elastic modulus, as well as in revealing the plastic deformation behaviors and mechanisms of various nanoscaled materials [ 23 , 24 , 25 , 26 ], thin films [ 27 , 28 , 29 , 30 , 31 ] and single-crystal materials [ 32 , 33 ]. Herein, we report the nanomechanical properties of Bi 2 Se 3 thin films deposited on c -plane sapphire substrates by PLD using nanoindentation with the aid of the continuous contact stiffness (CSM) mode.…”

Indentation fracture resistance of brittle materials using irregular cracks: A review

“…Methods such as Chevron Notch Beam (CNB) [ [11] , [12] , [13] ], Single-Edge Pre-cracked Beam (SEPB) [ 13 , 14 ], Single Edge Notch Beam (SENB) [ 14 , 15 ], Single Edge V-notch Beam (SEVNB) [ 16 , 17 ], Single Edge Laser Notch Beam (SELNB) [ 18 , 19 ], Double Cantilever Beam (DCB) [ [20] , [21] , [22] , [23] ], Wedge-insert Double Cantilever Beam (WDCB) [ 20 , 22 , 23 ], and End-Loaded Split (ELS) [ 24 , 25 ] are some of these techniques, and many of these methods have been used for many years to determine the K IC or K IFR of materials. In comparison, CFM is based on sharp indenters such as Vickers [ [26] , [27] , [28] , [29] , [30] ], Knoop [ [31] , [32] , [33] ], Berkovich [ 34 , 35 ], and Conical [ 36 ], which are applied to the sample in a certain period and amount of loading and are often used for brittle materials [ 34 , 36 ]. In general, the application of these techniques in the two groups varies according to the material, the manufacturing costs and testing of samples, and the required accuracy [ 3 ].…”