The Corrosion Behavior of Ni3(Si,Nb) Alloys in Boiling 70 wt.% Sulfuric Acid

Hsu, Jen-Hsien; Larson, Christopher M.; Newkirk, Joseph William; Brow, Richard K.; Zhang, Sanhong

doi:10.1007/s11665-016-1883-0

Cited by 6 publications

(4 citation statements)

References 14 publications

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“…Specifically, silver (Ag) and copper (Cu) add new properties without showing a significant difference in biocompatibility [ 25 ]. The properties of intermetallic thin films are usually better than pure metallic films due to their mixed bonding (metallic, covalent, and ionic) at specific stoichiometry [ 26 ]. Many authors have studied the antibacterial behavior of metallic elements such as Au, Cu, Zn, Ag, and their alloys because of their ability to kill bacteria up to a broad spectrum [ 27 ].…”

Section: Introductionmentioning

confidence: 99%

Influence of the Silver Content on Mechanical Properties of Ti-Cu-Ag Thin Films

et al. 2021

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In this work, the ternary titanium, copper, and silver (Ti-Cu-Ag) system is investigated as a potential candidate for the production of mechanically robust biomedical thin films. The coatings are produced by physical vapor deposition—magnetron sputtering (MS-PVD). The composite thin films are deposited on a silicon (100) substrate. The ratio between Ti and Cu was approximately kept one, with the variation of the Ag content between 10 and 35 at.%, while the power on the targets is changed during each deposition to get the desired Ag content. Thin film characterization is performed by X-ray diffraction (XRD), nanoindentation (modulus and hardness), to quantitatively evaluate the scratch adhesion, and atomic force microscopy to determine the surface topography. The residual stresses are measured by focused ion beam and digital image correlation method (FIB-DIC). The produced Ti-Cu-Ag thin films appear to be smooth, uniformly thick, and exhibit amorphous structure for the Ag contents lower than 25 at.%, with a transition to partially crystalline structure for higher Ag concentrations. The Ti-Cu control film shows higher values of 124.5 GPa and 7.85 GPa for modulus and hardness, respectively. There is a clear trend of continuous decrease in the modulus and hardness with the increase of Ag content, as lowest value of 105.5 GPa and 6 GPa for 35 at.% Ag containing thin films. In particular, a transition from the compressive (−36.5 MPa) to tensile residual stresses between 229 MPa and 288 MPa are observed with an increasing Ag content. The obtained results suggest that the Ag concentration should not exceed 25 at.%, in order to avoid an excessive reduction of the modulus and hardness with maintaining (at the same time) the potential for an increase of the antibacterial properties. In summary, Ti-Cu-Ag thin films shows characteristic mechanical properties that can be used to improve the properties of biomedical implants such as Ti-alloys and stainless steel.

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Section: Introductionmentioning

confidence: 99%

Influence of the Silver Content on Mechanical Properties of Ti-Cu-Ag Thin Films

et al. 2021

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“…Specifically, silver (Ag) and copper (Cu) are adding new properties without showing a significant difference in biocompatibility [25]. The properties of intermetallic thin films are usually better than pure metallic films due to their mixed bonding (metallic, covalent and ionic) at specific stoichiometry [26]. Many authors have studied the antibacterial behavior of metallic elements such as Au, Cu, Zn, Ag and their alloys because their ability to kill the bacterial up to broad spectrum [27].…”

Section: Introductionmentioning

confidence: 99%

Influence of the Silver Content on Mechanical Properties of Ti-Cu-Ag Thin Films

Rashid¹,

Sebastiani²,

Mughal³

et al. 2021

Preprint

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In this work, the ternary titanium, copper and silver (Ti-Cu-Ag) system is investigated as a potential candidate for the production of mechanically robust biomedical thin films. The coatings are produced by physical vapor deposition-magnetron sputtering (MS-PVD). The composite thin films are deposited on a silicon (100) substrate. The ratio between Ti and Cu was approximately kept one, with the variation of the Ag content between 10 and 35 at.%, while the power on the targets is changed during each deposition to get the desired Ag content. Thin film characterization is performed by x-ray diffraction (XRD), nanoindentation (modulus and hardness) and Atomic force microscopy to determine the surface topography. The residual stresses are measured by focused ion beam and digital image correlation method (FIB-DIC). The produced Ti-Cu-Ag thin films appear to be smooth, uniformly thick and exhibit amorphous structure for the Ag contents lower than 25 at.%, with a transition to partially crystalline structure for higher Ag concentrations. The Ti-Cu control film shows higher values of 124.5 GPa and 7.85 GPa for modulus and hardness respectively. There is a clear trend of continuous decrease in the modulus and hardness with the increase of Ag content, as lowest value of 105.5 GPa and 6 GPa for 35 at.% Ag containing thin films. In particular, a transition from the compressive (-36.5 MPa) to tensile residual stresses between 229 MPa and 288 MPa are observed with an increasing Ag content. The obtained results suggest that the Ag concentration should not exceed 25 at.%, in order to avoid an excessive reduction of the modulus and hardness with maintaining (at the same time) the potential for an increase of the antibacterial properties. In summary, Ti-Cu-Ag thin films shows characteristic mechanical properties that can be used to improve the properties of biomedical implants such as Ti-alloys and stainless steel.

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“…For example, Ni 3 Si alloy possesses an anomalous hardness-temperature relationship (an increase in strength with increasing temperature) and excellent oxidation resistance over a wide range of temperatures [1][2][3][4][5]. In addition, it also exhibits excellent corrosion resistance in sodium chloride and various acidic solutions [6][7][8][9]. Therefore, the alloy is the potential to be used in structural or chemical components, especially in high-temperature fields.…”

Section: Introductionmentioning

confidence: 99%

Friction and Wear Properties of Ni3Si Alloy with Ti Addition at High Temperatures

Niu

Bao

et al. 2020

Materials

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The tribological properties of Ni3Si alloy were studied at high temperatures. The effect of the addition of Ti was also analyzed. The surface composition was analyzed by Raman spectroscopy. The results showed that the friction coefficient decreased with the increasing temperature, and the wear rate changed slightly from 25 to 400 °C. However, the wear resistance of the alloys decreased sharply at 600 °C, and this was due to the decrease of the high-temperature strength and the severe oxidation of the alloys. Although the oxidation resistance of Ni3Si alloy decreased with Ti addition, the tribological property was improved by the addition of Ti. The Ni3Si alloy with 5% Ti addition had the best wear resistance at high temperatures as compared to pure Ni3Si alloy and with 10% Ti addition, and the wear rates of the alloys were in the order of magnitude of 10−5 mm3/Nm. With the increase of temperature, the wear mechanism of pure Ni3Si alloy transformed from abrasive wear to oxidation wear. As the Ti content increased, the wear mechanisms of the alloys changed from abrasive wear to fatigue wear at low temperature, and oxidation wear and fatigue wear at high temperature.

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The Corrosion Behavior of Ni3(Si,Nb) Alloys in Boiling 70 wt.% Sulfuric Acid

Cited by 6 publications

References 14 publications

Influence of the Silver Content on Mechanical Properties of Ti-Cu-Ag Thin Films

Influence of the Silver Content on Mechanical Properties of Ti-Cu-Ag Thin Films

Influence of the Silver Content on Mechanical Properties of Ti-Cu-Ag Thin Films

Friction and Wear Properties of Ni3Si Alloy with Ti Addition at High Temperatures

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