2006
DOI: 10.1016/j.tsf.2005.12.155
|View full text |Cite
|
Sign up to set email alerts
|

The contribution of grain boundary scattering versus surface scattering to the resistivity of thin polycrystalline films

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
4
1

Citation Types

1
20
0
1

Year Published

2006
2006
2023
2023

Publication Types

Select...
8

Relationship

0
8

Authors

Journals

citations
Cited by 38 publications
(22 citation statements)
references
References 11 publications
1
20
0
1
Order By: Relevance
“…[1][2][3] Clearly for these applications, the nucleation and grain growth mechanism play an important role in predetermining the final electronic, optical, and even magnetic characteristics of an organic thin film. [4][5][6][7] The characteristic length scale of crystallites can vary in size from a few nm to a few m and are measured by scanning electron microscopy, transmission electron microscopy, x-ray diffraction, and atomic force microscopy ͑AFM͒. Furthermore, the grain orientation can be mapped using transverse shear microscopy as had been shown for ultrathin pentacene films.…”
Section: Introductionmentioning
confidence: 99%
“…[1][2][3] Clearly for these applications, the nucleation and grain growth mechanism play an important role in predetermining the final electronic, optical, and even magnetic characteristics of an organic thin film. [4][5][6][7] The characteristic length scale of crystallites can vary in size from a few nm to a few m and are measured by scanning electron microscopy, transmission electron microscopy, x-ray diffraction, and atomic force microscopy ͑AFM͒. Furthermore, the grain orientation can be mapped using transverse shear microscopy as had been shown for ultrathin pentacene films.…”
Section: Introductionmentioning
confidence: 99%
“…The resistivity values were normalized to the resistivity of the copper prior to the cap deposition, which was cm Ω µ 29 . 4 . The sheet resistance of the cap layer was neglected, being at least two orders of magnitude higher than that of the copper.…”
Section: Comparison With Other Cap Layersmentioning
confidence: 99%
“…In previous studies we investigated the roles of grain boundaries [4] and of surface roughness [5] in increasing the resistivity of nanometric copper structures. In this study we focus on the role of interfaces and try to understand whether they can alter the resistivity values.…”
Section: Introductionmentioning
confidence: 99%
“…Subsequently, Mayadas and Shatzkes (MS) [8], based on experimental observations, [9] studied the grain boundary scattering on electric resistivity by extending FS theory. As a basic problem of microscale energy transport, the size effects on the electric resistivity of metallic nanostructures have been widely studied [10][11][12][13][14][15][16][17]. Since the thermal conductivity of metals is closely related to their electric conductivity [5,18], the size effect on thermal responses of metals is also an important problem in the field of microscale energy transport.…”
Section: Introductionmentioning
confidence: 99%