The constitutive relation of an axisymmetric detached coating on a rigid substrate

Nie, Pulin; Li, Zhuguo; Huang, Jian; Chen, Qiulong

doi:10.1016/j.ijmecsci.2010.09.004

Cited by 3 publications

(1 citation statement)

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“…[6][7][8] Therefore, further investigation the coupling effects of adhesion and residual stress is necessary so as to promote the reliability and lifespan of the adhesive systems. [9][10][11] Generally, blister test is not merely applicable to the mechanical properties of thin films, but can be employed to measure interfacial fracture energy which reflects the adhesive strength between thin films and rigid substrate. [12][13][14][15][16] The blister test was first proposed by Dannenberg [17] to measure interfacial fracture energy of thick organic coatings on metals.…”

Section: Introductionmentioning

confidence: 99%

A clamped punch-loaded blister test for adhesion: a lumped parameter model and the bending-to-stretching behavior

Feng

Shi

2015

Journal of Adhesion Science and Technology

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This paper presents a clamped punch-loaded blister test and the corresponding lumped parameter model for the adhesion between thin film and rigid substrate. In the test, circular thin film is adhered to rigid substrate and an external load is applied with a clamped punch to cause the deflection of thin film. The relations among load, deflection, residual stress and strain energy release rate are thoroughly investigated. Analytical solutions in linear and nonlinear behaviors are obtained and the bending and stretching effects are associated through a lumped parameter model. The result of lumped-parameter model shows that the blister deflection is directly proportional to the applied load in the linear bending dominant region and the blister deflection is in direct proportion to the cubic root of the applied load in the nonlinear stretching dominant region. This has been proved by the result of nonlinear finite element analysis and the experimental result as well.

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Section: Introductionmentioning

confidence: 99%

A clamped punch-loaded blister test for adhesion: a lumped parameter model and the bending-to-stretching behavior

Feng

Shi

2015

Journal of Adhesion Science and Technology

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Validation by asymptotic development of the empirical bulge test formula

Grilhé

Coupeau

Cimetière

et al. 2012

Surface and Coatings Technology

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Nonlinear Large Deflection of Thin Film Overhung on Compliant Substrate Using Shaft-Loaded Blister Test

Feng

Shi

2015

Journal of Applied Mechanics

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This paper presents the nonlinear large deflection of the thin film and the effect of substrate deformation on the thin film deflection through the shaft-loaded blister test. The blister of thin film can be divided into two parts, namely, the annular contact brim and the central noncontact bulge. A two-coupled line spring model is developed to describe the deformation of the contact part, and Föppl–Hencky equations are employed to study the constitutive relation between the applied load and the central deflection. The analytical and numerical solutions for the constitutive relation between the applied load and the deflection of thin film with considering the deformation of substrate are derived.

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The constitutive relation of an axisymmetric detached coating on a rigid substrate

Cited by 3 publications

References 20 publications

A clamped punch-loaded blister test for adhesion: a lumped parameter model and the bending-to-stretching behavior

A clamped punch-loaded blister test for adhesion: a lumped parameter model and the bending-to-stretching behavior

Validation by asymptotic development of the empirical bulge test formula

Nonlinear Large Deflection of Thin Film Overhung on Compliant Substrate Using Shaft-Loaded Blister Test

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