The connection between sputter cleaning and adhesion of thin solid films

Koski, Kari; Hölsä, Jorma; Ernoult, J.; Rouzaud, A.

doi:10.1016/0257-8972(95)02710-6

Cited by 40 publications

(17 citation statements)

References 6 publications

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“…The sputter cleaning process largely removed substrate surface contaminant, as well as adsorbed gas molecules, to produce a clean, highly active surface 4 ; the ion bombarding process during sputtering enhanced atomic diffusion and mixing in the nearinterface region. 24,36 The higher average adhesion strength of the monolithic HA sputtered on the rougher substrate surface (Ra = 0.7 m) than on the smoother surface (Ra = 0.06 m) might be due to a mechanical interlocking effect 2,3 that somehow was not as significant for Ti-containing coatings.…”

Section: Adhesion Strength and Microhardnessmentioning

confidence: 94%

“…It is not certain whether the observed extra peaks [such as (112)] were due to the somewhat different deposition parameters that might affect the HA coating structure. For example, Koski et al 24 suggested that, during sputter cleaning of substrate, the bombardment of energetic argon ions could change the structure of the substrate and affect the growth of the HA coating.…”

Section: Coating Thickness and Deposition Ratementioning

confidence: 99%

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Characterization of hydroxyapatite and titanium coatings sputtered on Ti-6Al-4V substrate

Ding

Lin

1999

J. Biomed. Mater. Res.

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A series of thin (<10 microm), single-layered HA/Ti coatings were deposited on Ti-6Al-4V substrate using a radio frequency magnetron-assisted sputtering system. The adhesion strength, microstructure, and chemistry of the coatings were characterized. Experimental results showed that higher Ti contents in targets or coatings resulted in higher deposition rates. When Ti was added the highly crystalline structure of monolithic HA coating was largely disrupted and the coating became amorphous-like. The highly crystalline structure of the monolithic Ti coating was also disrupted by introducing small amounts of Ca, P, and O into the coating. The HA/Ti coatings had quite uniform thicknesses and appeared smooth, dense, and well bonded to the substrate. A scanning electron microscope with an energy dispersive spectroscopy system showed that monolithic HA, 95HA/5Ti, 25HA/75Ti, and 50HA/50Ti coatings had the lowest Ca/P ratios while the 75HA/25Ti coating had the highest. The adhesion strengths of all coatings were between 60 and 80 MPa.

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Section: Adhesion Strength and Microhardnessmentioning

confidence: 94%

Section: Coating Thickness and Deposition Ratementioning

confidence: 99%

Characterization of hydroxyapatite and titanium coatings sputtered on Ti-6Al-4V substrate

Ding

Lin

1999

J. Biomed. Mater. Res.

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“…Thereafter, the substrates were introduced into the sputter chamber, in which the argon ion sputter-cleaning process was first employed to remove the adsorbed species (e.g. hydrocarbon contamination) and the native surface oxide in order to enhance the thin film adhesion [9]. Thereafter, commercial purity nickel (Ni) (N99.9%) metal disc and silicon (Si) (100) wafer targets were co-sputtered by means of 2 low energy argon ion beams (≤500 eV) generated simultaneously from two Kaufmantype ion sources.…”

Section: Methodsmentioning

confidence: 99%

Sputter deposition and XPS analysis of nickel silicide thin films

Tam

Nyborg

2009

Surface and Coatings Technology

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“…Meanwhile contamination, the physical properties (such as surface roughness) of the substrate, film thickness, and some sputtering parameters (such as sputtering pressure, substrate temperature, and bias voltage), etc., have an effect on adhesion [24][25][26][27][28][29], which influences operational stability of electrochemical capacitors. In addition, ruthenium oxide films were deposited on Si and Ti substrates by reactive radio frequency (RF) magnetron sputtering and the total anodic voltammetric charges increased with increasing roughness factor [30].…”

Section: Introductionmentioning

confidence: 99%

Fabrication of manganese oxide electrodes by radio frequency sputtering for electrochemical capacitors

Lin

Lee

2009

J Appl Electrochem

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Manganese oxide thin films were sputtered on graphite foils by radio frequency (RF) sputtering. At the 1,000th cycle of potential cycling, maximum mass specific capacitance of 341 F g -1 was obtained in 0.5 M LiCl and with optimum sputtering conditions (5 sccm of oxygen, 20 mTorr, and 70 W) as well as annealing temperature (150°C). These show its high electrochemical stability and good mass specific capacitance at a higher sweep rate of 100 mV s -1 . In addition, the higher the volume flow rates of oxygen, the larger the amount of trivalent manganese oxide and the higher the surface roughness, the higher the mass specific capacitance at lower volume flow rates of oxygen, but the amounts of trivalent manganese oxide were almost the same and the mass specific capacitance decreased due to decreasing surface roughness at higher volume flow rates of oxygen. Furthermore, the geometric specific capacitance increases with increasing sputtering pressure and power.

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The connection between sputter cleaning and adhesion of thin solid films

Cited by 40 publications

References 6 publications

Characterization of hydroxyapatite and titanium coatings sputtered on Ti-6Al-4V substrate

Characterization of hydroxyapatite and titanium coatings sputtered on Ti-6Al-4V substrate

Sputter deposition and XPS analysis of nickel silicide thin films

Fabrication of manganese oxide electrodes by radio frequency sputtering for electrochemical capacitors

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