2021 35th Symposium on Microelectronics Technology and Devices (SBMicro) 2021
DOI: 10.1109/sbmicro50945.2021.9585769
|View full text |Cite
|
Sign up to set email alerts
|

The conduction mechanisms analysis of AlGaN/GaN MOSHEMTs with different source/drain electrode configurations

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
2

Citation Types

0
4
0

Year Published

2022
2022
2023
2023

Publication Types

Select...
3
3

Relationship

0
6

Authors

Journals

citations
Cited by 6 publications
(5 citation statements)
references
References 8 publications
0
4
0
Order By: Relevance
“…As reported in [29], the transconductance curve of the metal gate/Si 3 N 4 /AlGaN/AlN/GaN MISHEMT presents multiple slopes due to the presence of multiple conduction channels caused by the HEMT and MIS conductions. Since the studied MISHEMT has a negative threshold voltage, with a gate voltage (V GS ) of 0 V there are three high populations of electrons, two of them are located at the 3rd and 2nd interfaces due to III-V materials heterostructure, namely two 2DEG, and one of them is located at the 1st interface, which mechanism is similar to a depletion mode nMOSFET.…”
Section: Results and Analysismentioning
confidence: 73%
See 2 more Smart Citations
“…As reported in [29], the transconductance curve of the metal gate/Si 3 N 4 /AlGaN/AlN/GaN MISHEMT presents multiple slopes due to the presence of multiple conduction channels caused by the HEMT and MIS conductions. Since the studied MISHEMT has a negative threshold voltage, with a gate voltage (V GS ) of 0 V there are three high populations of electrons, two of them are located at the 3rd and 2nd interfaces due to III-V materials heterostructure, namely two 2DEG, and one of them is located at the 1st interface, which mechanism is similar to a depletion mode nMOSFET.…”
Section: Results and Analysismentioning
confidence: 73%
“…The HEMT current, coming from the 2nd and 3rd interfaces, depends on the depletion depth, which is also affected by temperature. In addition, the bandgap also has a dependency on the temperature, playing an even major role on the HEMT conduction [29]. Figure 2 shows the MISHEMT's transfer curve (I DS × V GS ) and transconductance (g m ) curve at 350 K and low V DS .…”
Section: Results and Analysismentioning
confidence: 99%
See 1 more Smart Citation
“…While MIS-HEMT device presents 17 µA, 77 µA, and 194 µA, for increasing VGT from 0V to 400mV, for MOSFETs the current level for the same bias condition reaches only 0.55 µA, 2.4 µA and 7 µA, respectively. Previous works (5)(6)(7)(8) showed that the MIS-HEMT have multiple conduction mechanisms (MOS and HEMT conductions) and that these conductions are very dependent on VGT. Figure 3 shows output characteristics for several VGT voltages.…”
Section: Resultsmentioning
confidence: 99%
“…On a MISHEMT with spacer layer, three current channels are formed, one at the interface between the gate insulator and the barrier layer (1 st interface), one near the interface between barrier layer and spacer layer (2 nd interface), and one at the interface between spacer layer and buffer layer (3 rd interface). The channel at the 1 st interface is an accumulation of electrons due to field effect from MIS structure, and the channels at 2 nd and 3 rd interfaces are 2DEGs formed by internal polarizations [9]. As an extension of [10], the goal of the current work is to investigate how each one of these channels affects the performance in the electrical behavior of the MISHEMT, focusing mainly on DC parameters.…”
Section: Introductionmentioning
confidence: 99%