1994
DOI: 10.1351/pac199466061185
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The chemistry of etching and deposition processes

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1994
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Cited by 5 publications
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“…A few products however, such as WF 4 and WF 5 are not volatile. They can be removed by low-energy ion bombardment and X-ray irradiation [26].…”
Section: Etching Processmentioning
confidence: 99%
“…A few products however, such as WF 4 and WF 5 are not volatile. They can be removed by low-energy ion bombardment and X-ray irradiation [26].…”
Section: Etching Processmentioning
confidence: 99%