The characterization of telephone cord buckling of compressed thin films on substrates

Moon, Minkyu; Jensen, Henrik Myhre; Hutchinson, John W.; Oh, Kyoung-Hee; Evans, A.G.

doi:10.1016/s0022-5096(02)00034-0

Cited by 210 publications

(113 citation statements)

References 25 publications

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“…Moreover, annealing can lead to more serious decohesion phenomena such as the telephone-cord buckling (Hutchinson et al, 1992;Moon et al, 2002) observed in Figure 7 b) or even complete decohesion. This result suggests that if the binding is poor, the passage of C atoms through the interface to form carbides on annealing is strongly reduced, which would explain the absence of a change in layer thickness as shown in most samples (except for W:C and Cr:O:C) in Table 1.…”

Section: Discussionmentioning

confidence: 99%

Thermal boundary conductance of transition metals on diamond

Monachon

Weber

2012

Emerging Materials Research

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An experimental process that was used to obtain a direct measurement of thermal boundary conductance (TBC) between a diamond substrate and several transition metals, deposited by sputtering, is described. Using time-domain thermoreflectance (TDTR), the critical parameters, for a proper interpretation of the results, are evaluated to be the laser spot size and the thickness of the metallic thin films. Values of TBC between Cu, Cr, Nb, Mo, W and diamond are presented and vary between 30 and 280 MW/m2/K. The adhesion of the layer to the substrate is seen to be critical to obtain a high TBC. Annealing in vacuum at temperatures up to 600°C does not significantly seem to change the results obtained. When diamond surface is oxygen plasma treated for better adhesion, the TBC between Cr and diamond is measured to be 325 MW/m2/K. This represents an 11-fold increase compared to untreated diamond.

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Section: Discussionmentioning

confidence: 99%

Thermal boundary conductance of transition metals on diamond

Monachon

Weber

2012

Emerging Materials Research

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“…Straight sided blisters propagate with a curved front which transform in to telephone cord blisters. The corresponding mechanics for telephone cord blisters are less well developed; some basic modelling concepts [34] and an advanced experimental analysis can be found in [35]. The conditions at the stationary side and the circular front of a propagating blister has been modelled and rationalized in terms of mode mixity and energy release rate [22,36].…”

Section: Buckle Delaminationmentioning

confidence: 99%

A review of theoretical analysis techniques for cracking and corrosive degradation of film-substrate systems

Nazir

Khan

2017

Engineering Failure Analysis

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This paper contains a review of the most vital concepts regarding the analysis and design of film systems. Various techniques have been presented to analyse and predict the failure of films for all common types of failure: fracture, delamination, general yield, cathodic blistering, erosive and corrosive wear in both organic and inorganic films. Interfacial fracture or delamination is the loss of bonding strength of film from substrate, and is normally analysed based on the fracture mechanics concepts of bi-material systems. Therefore, keeping the focus of this review on bonding strength, the emphasis will be on the interfacial cracking of films and the corresponding stresses responsible for driving the delamination process. The bi-material characteristics of film systems make the nature of interfacial cracks as mixed mode, with cracks exhibiting various complex patterns such as telephone cord blisters. Such interfacial fracture phenomenon has been widely studied by using fracture mechanics based applicable analysis to model and predict the fracture strength of interface in film systems. The incorporation of interfacial fracture mechanics concepts with the thermodynamics/diffusion concepts further leads to the development of corrosive degradation theories of film systems such as cathodic blistering. This review presents the suggestions for improvements in existing analysis techniques to overcome some of the limitations in film failure modelling. This comprehensive review will help researchers, scientists, and academics to understand, develop and improve the existing models and methods of film-substrate systems.

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“…by direct pull-off techniques [21][22][23] , blister tests 22,24 , laser spallation 20 , film buckling 22,25,26 , or scratch tests 27 . Experimental details, such as finding a way to glue the pull-out pad more strongly than the interface, reduce the range of adhesion energy values that can be obtained by the first methods.…”

Section: Introductionmentioning

confidence: 99%

Qualitative link between work of adhesion and thermal conductance of metal/diamond interfaces

Monachon

Schusteritsch

Kaxiras

et al. 2014

Journal of Applied Physics

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We report Time-Domain ThermoReflectance experiments measuring the Thermal Boundary Conductance (TBC) of interfaces between diamond and metal surfaces, based on samples consisting of [111] diamond substrates with hydrogen or with sp 2 carbon surface terminations created using plasma treatments. In a concurrent theoretical study, we calculate the work of adhesion between Ni, Cu and diamond interfaces with [111] surface orientation, with or without hydrogen termination of the diamond surface, using first-principles electronic structure calculations based on density functional theory (DFT).We find a positive correlation between the calculated work of adhesion and the mea-sured conductance of these interfaces, suggesting that DFT could be used as a screening tool to identify metal/dielectric systems with high TBC We also explain the negative effect of hydrogen on the thermal conductance of metal/diamond interfaces. a) Corresponding author,

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The characterization of telephone cord buckling of compressed thin films on substrates

Cited by 210 publications

References 25 publications

Thermal boundary conductance of transition metals on diamond

Thermal boundary conductance of transition metals on diamond

A review of theoretical analysis techniques for cracking and corrosive degradation of film-substrate systems

Qualitative link between work of adhesion and thermal conductance of metal/diamond interfaces

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