2015
DOI: 10.1147/jrd.2014.2376131
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The cache and memory subsystems of the IBM POWER8 processor

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Cited by 49 publications
(27 citation statements)
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References 16 publications
(24 reference statements)
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“…Each POWER8 core owns a store-through L1 data cache, a store-in L2 cache, and an eDRAM based L3 cache with a capacity of 64 KB, 512 KB, and 8 MB, respectively. The L3 caches of POWER8 have a NUCA (NonUniform Cache Architecture) design, with each L3 also serving requests for other cores, and working as a victim cache for other L3s [26]. Additionally, the POWER8 processor is connected to a maximum of eight external memory buffer chips called Centaur.…”
Section: Overview Of Power8mentioning
confidence: 99%
“…Each POWER8 core owns a store-through L1 data cache, a store-in L2 cache, and an eDRAM based L3 cache with a capacity of 64 KB, 512 KB, and 8 MB, respectively. The L3 caches of POWER8 have a NUCA (NonUniform Cache Architecture) design, with each L3 also serving requests for other cores, and working as a victim cache for other L3s [26]. Additionally, the POWER8 processor is connected to a maximum of eight external memory buffer chips called Centaur.…”
Section: Overview Of Power8mentioning
confidence: 99%
“…On the POWER8 processor chip, the PCIe Host Bridge (PHB) provides connectivity to PCIe Gen3 I/O links. The Coherent Accelerator Processor Proxy (CAPP) unit, in conjunction with the PHB, act as memory coherence, data transfer, interrupt, and address translation agents on the SMP interconnect [9] fabric for PCIe-attached accelerators. These accelerators comprise a POWER Service Layer (PSL) and Accelerator Function Units (AFUs) that reside in an FPGA or ASIC connected to the processor chip by the PCIe Gen3 link.…”
Section: Capi System Descriptionmentioning
confidence: 99%
“…The CAPP structures and machines parallel those of the L2 cache directory described in [9], while the data-portion of the cache is maintained by the PSL. Figure 2 shows the CAPP hardware in greater detail.…”
Section: Capp Hardware Descriptionmentioning
confidence: 99%
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“…As described in a later section of this paper, the fabrication of the broad device suite offerings is more straightforward and fabricated with larger process robustness. This enables a full-featured system-on-chip (SoC) capability with confident yield projections and compact model projections, making possible a range of first-time-right analog functions to support both the processor and the memory buffer chip [3].…”
Section: Introductionmentioning
confidence: 99%