2022
DOI: 10.1007/s11666-022-01379-z
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The Bonding Formation during Thermal Spraying of Ceramic Coatings: A Review

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Cited by 34 publications
(8 citation statements)
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“…Therefore, taking ν s and µ into Eq. 2, σ = 86.6 ± 26.5 MPa can be calculated, which achieves the optimal level of interfacial bonding strength for the ceramic-based films fabricated on metal substrates (20 < σ < 100 MPa) [43,44].…”
Section: Properties and Performance Of Sioc-wox Gradient Nanocomposit...mentioning
confidence: 90%
“…Therefore, taking ν s and µ into Eq. 2, σ = 86.6 ± 26.5 MPa can be calculated, which achieves the optimal level of interfacial bonding strength for the ceramic-based films fabricated on metal substrates (20 < σ < 100 MPa) [43,44].…”
Section: Properties and Performance Of Sioc-wox Gradient Nanocomposit...mentioning
confidence: 90%
“…To achieve strong adhesion, the distance between interacting atoms must be maintained at less than 1 nm. Additionally, a clean surface, interaction between the atoms, and a metallic connection are necessary to establish physical interaction between particles and enhance adhesion [54].…”
Section: Thermal Conductivity Testmentioning
confidence: 99%
“…During film adhesive joining process, one or more well-known bonding mechanisms could operate. 4 For instance, “mechanical bonding” might take place due to the certain degree of surface roughness leading to “interlocking” action at the interface. “Secondary bonding” might occur due to the “polar interactions” between the surfaces.…”
Section: Introductionmentioning
confidence: 99%