The Automobile: Unwanted Technology - The Later Years Part I: Cars and Crises 1960-1990 Part II: The Dawning of Automotive Electronics

Yanik, Anthony J.

doi:10.4271/920845

Cited by 1 publication

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“…The growth in electronic contents per vehicle has seen an explosive rise from an average of US$78 in 1980 to US$861 in 1990 and then to US$1,495 by 1998. 1,2 This corresponds to an increase in the average electronic cost per vehicle from 13% (1980s) to 17% (1990s) and is forecast to break into the +20% range with the addition of more software in the current decade. In the topof-the-range cars, the electronic content can amount to 35% of the total vehicle cost.…”

Section: Introductionmentioning

confidence: 99%

Statistical Optimisation of Thermoplastic Injection Moulding Process for the Encapsulation of Electronic Subassembly

Teh

Conway

Palmer

et al. 2000

Journal of Electronics Manufacturing

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This paper reports work from a major UK research project which seeks to develop a cost effective integrated production technology for the manufacture of plastic automotive components with embedded electronics and power distribution. The said electronics sub-systems are simultaneously packaged within the automotive structural thermoplastic (TP) component during the injection moulding process. Such innovative process and product integration represents an opportunity to significantly reduce component counts and wiring loom overhead for the vehicle. The assembly, weight and cost advantages envisaged from the proposed technology will satisfy the ever-increasing demand for automotive suppliers to manufacture complete, ready-to-assemble, reconfigurable component modules with superior reliability and as such may contribute to the increased incorporation of vehicle telematics.The paper addresses the technological and economic implications of the proposed overmoulding technology, presenting particular aspects of technological hurdles such as thermal, electrical and process requirements in the production of highly integrated polymer encapsulated electronics products. This paper highlights the findings derived from experiments undertaken to explore critical factors in the manufacture of such encapsulated electronics sub-systems, including such variables as electronics interconnection, materials selection and interactions and moulding process parameters.

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Section: Introductionmentioning

confidence: 99%