The Analysis of Nickel Sulphamate Plating Solutions

Electroforming in the Industry 4.0 Era

“…Industrial development has provided copious empirical process data [19], including operating parameters required for stable operation [15,19] as well as methods of monitoring bath chemistry [20]. Understandably, much of that work focused on optimising deposit internal stress as a function of operating parameters [18,21], anode material [22], growth rate and grain size [23] as well as identifying chemicals lowering internal stress [24].…”

“…Since the formation of [OH]is undesirable, boric acid (H3BO3) is added to nearly all nickel electrodeposition solutions [39,[41][42][43][44]47]. The use of boric acid was recorded in 1954 [49], and process descriptions of sulphamate electrolytes recommend the use of boric acid as a buffering agent to obtain current efficiencies of 100% [18][19][20][21][22][23][24]. The buffering action of boric acid near the electrode surface however, has been contested by other researchers [50,51] This is a peer-reviewed, accepted author manuscript of the following article: Roy, S., & Andreou, E. (2020).…”