2009
DOI: 10.1007/bf03218645
|View full text |Cite
|
Sign up to set email alerts
|

The alignment of liquid crystals on the film surfaces of soluble aromatic polyimides bearingt-butylphenyl and trimethylsilylphenyl side groups

Abstract: With the study goal of firstly elucidating the anisotropic interactions between oriented polymer chain segments and liquid crystal (LC) molecules, and secondly of determining the contributions of the chemical components of the polymer segments to the film surface topography, LC alignment, pretilt, and anchoring energy, we synthesized three dianhydrides, 1,4-bis(4'-t-butylphenyl)pyromellitic dianhydride (BBPD), 1,4-bis(4'-trimethylsilylphenyl)pyromellitic dianhydride (BTPD), and 2,2'-bis(4''-tert-butylphenyl)-4… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2

Citation Types

0
2
0

Year Published

2010
2010
2016
2016

Publication Types

Select...
6

Relationship

0
6

Authors

Journals

citations
Cited by 6 publications
(2 citation statements)
references
References 104 publications
0
2
0
Order By: Relevance
“…In general, API films used for flexible copper clad laminates (FCCLs) should have a great combination of mechanical, thermal, and dielectric properties, including high modulus and toughness, high glass transition temperature (T g ), low coefficient of thermal expansion (CTE), low coefficient of humidity expansion, low dielectric constant, and dissipation factor, because the films must contact and support the copper circuits and resist the harsh thermal shocks during production of electric circuits. [1][2][3][4][5][6][7][8][9][10] It has been known that the common API films usually have CTE values in the film plane direction of 40-60 ppm/ K, much higher than that of copper foil (17.8 ppm/K).…”
Section: Introductionmentioning
confidence: 99%
“…In general, API films used for flexible copper clad laminates (FCCLs) should have a great combination of mechanical, thermal, and dielectric properties, including high modulus and toughness, high glass transition temperature (T g ), low coefficient of thermal expansion (CTE), low coefficient of humidity expansion, low dielectric constant, and dissipation factor, because the films must contact and support the copper circuits and resist the harsh thermal shocks during production of electric circuits. [1][2][3][4][5][6][7][8][9][10] It has been known that the common API films usually have CTE values in the film plane direction of 40-60 ppm/ K, much higher than that of copper foil (17.8 ppm/K).…”
Section: Introductionmentioning
confidence: 99%
“…Aromatic polyimides (PIs) are well known as high‐performance polymeric materials because of their excellent thermal stability and balanced mechanical and electrical properties 6–8. In addition, these high‐performance materials have also attracted interest in the photonics or optics industries for applications in optics coatings and thin photonic devices.…”
Section: Introductionmentioning
confidence: 99%