The next generation of power devices are likely to extend MOS controlled bipolar (MCB) device concepts to cover very high voltage (up to 8 kV) applications. Such devices will be based on utilizing the advantages brought about by trench gate MOSFETs to control bipolar current¯ow. In this paper we give a review of development of trench gate IGBTs and we describe brie¯y new promising device structures based on trench technology which use PIN diode and thyristor type carrier distributions to reduce power losses within the device.