Bell System Technical Journal

1971

DOI: 10.1002/j.1538-7305.1971.tb02597.x

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TH-3 Microwave Radio System: Microwave Transmitter and Receiver

Randy M. Jensen²

Abstract: The features and performance of a 6‐GHz transmitter and receiver are described in this paper. The system objectives of 41 dBrncO for 4000 miles at 1800‐circuit loading derived in the previous paper are applied to the design. With the exception of the 10‐watt traveling‐wave tube, the equipment is all solid state.

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TH-3 Microwave Radio System: System Considerations

1971

Bell System Technical Journal

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This paper gives a general description of the TH‐3 long‐hual microwave radio system which operates in the 6 GHz common carrier band. Performance objectives are expressed, and the allocation of noise to the various contributors is developed. Particular attention is given to the balance between intermodulation noise and tertiary interference. In conclusion, the predicted performance is compared with measurements made on the initial installation.

TH-3 Microwave Radio System: System Considerations

1971

Bell System Technical Journal

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This paper gives a general description of the TH‐3 long‐hual microwave radio system which operates in the 6 GHz common carrier band. Performance objectives are expressed, and the allocation of noise to the various contributors is developed. Particular attention is given to the balance between intermodulation noise and tertiary interference. In conclusion, the predicted performance is compared with measurements made on the initial installation.

TH-3 Microwave Radio System: Networks

1971

Bell System Technical Journal

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TH-3 Microwave Radio System: Microwave Integrated Circuits

1971

Bell System Technical Journal

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Microwave integrated circuits have been employed in the Bell System for the first time in the TH‐3 radio system. These circuits, using strip transmission lines, provide numerous functions previously achieved with assemblies of individual waveguide components. By utilizing the modern technologies of photolithography, precision die casting, ceramic processing, and tantalum‐gold thin films, these circuits provide advantages in size, fabrication, bay “layout,” performance, and cost.

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