2003
DOI: 10.1016/s0927-0248(02)00214-3
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Texturisation of multicrystalline silicon wafers for solar cells by reactive ion etching through colloidal masks

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Cited by 71 publications
(32 citation statements)
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“…Unfortunately, these methods are inefficient for multicrystalline silicon due to the presence of random crystallographic grain orientations and high selectivity of etching along specific directions. Consequently, it is impossible to obtain homogeneous texturization of the whole surface [2][3][4]. Another possibility is laser texturization [5,6], which is unfortunately, not satisfactory due to possible mechanical damages, resulting in breakability and fragility of silicon along with a very small thickness of the silicon wafers.…”
Section: Introductionmentioning
confidence: 99%
“…Unfortunately, these methods are inefficient for multicrystalline silicon due to the presence of random crystallographic grain orientations and high selectivity of etching along specific directions. Consequently, it is impossible to obtain homogeneous texturization of the whole surface [2][3][4]. Another possibility is laser texturization [5,6], which is unfortunately, not satisfactory due to possible mechanical damages, resulting in breakability and fragility of silicon along with a very small thickness of the silicon wafers.…”
Section: Introductionmentioning
confidence: 99%
“…Unfortunately, these methods are inefficient for multicrystalline silicon due to the presence of random crystallographic grain orientations and high selectivity of etching along specific directions. Consequently, it is impossible to obtain texturization of homogeneous structure on the whole surface [6][7][8][9]11]. Another possibility is mechanical texturization [14].…”
Section: Introductionmentioning
confidence: 99%
“…Many physical and chemical methods have been proposed for texturing of silicon surface, such as mechanical grooving [25], lithography followed by reactive ion etching [26], laser texturing [27], and electrochemical etching. Porous silicon prepared by electrochemical etching is of interest due to the ability for fabricating various structures and cost effectiveness [28,29].…”
Section: Preparation Of Macro-porous Siliconmentioning
confidence: 99%