Texture transition in Cu thin films: Electron backscatter diffraction vs. X-ray diffraction

Sonnweber-Ribic, Petra; Gruber, Patric A.; Dehm, Gerhard; Arzt, Eduard

doi:10.1016/j.actamat.2006.03.057

Cited by 69 publications

(23 citation statements)

References 12 publications

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“…It was found that the vertical grain size (d v ) was always larger than the horizontal grain size (d h ), which indicates that the film exhibits columnar grain structure. The microstructure characterization by surface analysis reported by other researchers 12,16,17) would not be identical to that determined by the cross-sectional measurement because the surface view shows the horizontal sectioning of the film but cannot provide any information of the vertical sectioning. Mirpuri et al 12) identified the columnar grain structure of copper films in a FIB cross-sectional image but provided incomplete information of the microstructure evolution because EBSD mapping was carried out only on the film surface.…”

Section: Electron Backscatter Diffraction Characterization Of Microstmentioning

confidence: 88%

“…This microstructure composed of HAGBs and twin boundaries could be formed during electroplating or room temperature recrystallization right after electroplating (self annealing). The microstructure of the electrodeposits can be changed by increasing the film thickness 16) and by altering the electroplating conditions. …”

Section: Ebsd Measurement and Analysismentioning

confidence: 99%

“…18) Cross-sectional observation is essential for identifying columnar grain structures of copper films. EBSD measurement only on the film surface 12,16,17) does not provide overall information throughout the thickness of the specimens. The cross-sectional EBSD measurement by Pantleon et al 18) would not be guaranteed because many numbers of the pixels remained non-indexed and the grain morphology was not identified.…”

Section: Introductionmentioning

confidence: 99%

“…12,16,17) EBSD provides information on the grain size and morphology statistics and grain boundary characteristics, as well as the crystal orientation of the individual grains. There have been several studies involving the EBSD analysis of copper films, 12,16,17) but systematic studies by means of cross-sectional mapping are still lacking. 18) Cross-sectional observation is essential for identifying columnar grain structures of copper films.…”

Section: Introductionmentioning

confidence: 99%

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Electron Backscatter Diffraction Characterization of Microstructure Evolution of Electroplated Copper Film

2010

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The microstructure evolution of electroplated copper films was characterized by electron backscatter diffraction (EBSD). Special care was taken during the preparation of the cross-sectional specimens and microstructure analysis to obtain reliable results. The film exhibited a columnar grain structure with a large fraction of twin boundaries. Annealing induced normal grain growth and caused many of the general highangle grain boundaries to be replaced by twin boundaries, possibly by annealing twinning.

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Section: Electron Backscatter Diffraction Characterization Of Microstmentioning

confidence: 88%

Section: Ebsd Measurement and Analysismentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Electron Backscatter Diffraction Characterization of Microstructure Evolution of Electroplated Copper Film

2010

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“…[21,22]). In the present case, the preferred growth of grains with {111}-planes oriented parallel to the specimen surface suggests that grain growth may be affected by surface/interface energy effects.…”

Section: Discussionmentioning

confidence: 99%

Grain growth in nanocrystalline copper thin films investigated by non-ambient X-ray diffraction measurements

et al. 2009

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The microstructure evolution (crystallite size and microstrain) as well as the residual stress of Cu thin films of various thicknesses (250 nm, 500 nm and 1 ìm) on passivated Si substrates during isochronal annealing was investigated by in-situ X-ray diffraction measurements in the temperature range between 25°C and 250°C.Before annealing, the thermoelastic behaviour was investigated excluding the occurrence of thermally activated relaxation processes occurring above ambient temperature by in-situ stress measurements below ambient temperature. On this basis, above ambient temperature, effects of stress relaxation and emerging secondary stresses (due to grain growth and annihilation of crystal defects, giving rise to a considerable tensile stress contribution development) could be identified for all three layers in the temperature regime between ambient temperature and 250°C.Grain growth in the nanocrystalline thin films started at much lower temperatures as compared to coarse-grained materials. The results were discussed in terms of the effects of different driving forces and grain-boundary mobilities acting in nanocrystalline materials.

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Solid-state dewetting for fabrication of metallic nanoparticles and influences of nanostructured substrates and dealloying

Wang

Schaaf

2013

Phys. Status Solidi A

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Solid-state dewetting of thin metallic films deposited on an inert substrate is considered as a simple method for the fabrication of metal nanoparticles and alloy nanoparticles. By combining other processes such as nanolithography and dealloying, ordered arrangements or complex arrangements of nanoparticles can be realized as well. The driving force for dewetting is the reduction of the surface energy and the interface energy between film and substrate. It occurs via diffusion even in the solid state at the temperature well below the melting point of the metal films. However, the mechanisms of solid-state dewetting are more complicated than those of liquid-state dewetting due to the interplay with additional processes, like grain growth, texture evolution, faceting (anisotropic diffusion), evaporation, and even alloying. Dewetting of metallic bilayers with two different types of metals can also serve as a simple method to investigate the alloying behavior in the nanoscale.

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Texture transition in Cu thin films: Electron backscatter diffraction vs. X-ray diffraction

Cited by 69 publications

References 12 publications

Electron Backscatter Diffraction Characterization of Microstructure Evolution of Electroplated Copper Film

Electron Backscatter Diffraction Characterization of Microstructure Evolution of Electroplated Copper Film

Grain growth in nanocrystalline copper thin films investigated by non-ambient X-ray diffraction measurements

Solid-state dewetting for fabrication of metallic nanoparticles and influences of nanostructured substrates and dealloying

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