Texture evolution and microstructural changes during solid-state dewetting: A correlative study by complementary in situ TEM techniques

Niekiel, Florian; Kraschewski, Simon M.; Schweizer, Peter; Butz, Benjamin; Spiecker, Erdmann

doi:10.1016/j.actamat.2016.05.026

Cited by 25 publications

(17 citation statements)

References 54 publications

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“…Solid state dewetting depends on several parameters such as initial film thickness, deposition method, substrate, annealing temperature, time and atmosphere [29,31,33]. Furthermore, it is known that grain growth, texture, grain boundaries and triple junctions play an important role on the dewetting process [29,34,35].…”

Section: Introductionmentioning

confidence: 99%

“…Both fields have received considerable research interest and the dewetting process has been comprehensively reviewed [29,30,40,41] and widely investigated in the past decade. Within those investigations, electron microscopy was frequently applied to investigate the post-annealing film surface [42,43], whilst some in-situ microscopy investigation have recently been carried out [34,[44][45][46]. However, only a few of these studies investigated the effect of crystallographic orientation on the dewetting process [31,35,46].…”

Section: Introductionmentioning

confidence: 99%

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Elevated temperature transmission Kikuchi diffraction in the SEM

Fanta

Todeschini

Burrows

et al. 2018

Materials Characterization

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Elevated temperature transmission Kikuchi diffraction in the SEM

Fanta

Todeschini

Burrows

et al. 2018

Materials Characterization

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“…Interpretation of dynamics on post-mortem samples is challenging due to the loss of time resolution which may obscure the actual interplay of the dominating mechanisms [1,2].…”

Section: Introductionmentioning

confidence: 99%

“…Solid state dewetting of thin films without capping layers was observed by various insitu techniques including electrical resistance measurements [18], Auger electron spectroscopy [19], low-energy electron microscopy [20], laser light transmission [21,22], confocal laser microscopy [23,24], atomic force microscopy [25], X-ray diffraction [13,26,27], time resolved differential reflectometry [28], scanning electron microscopy (SEM) [1,29] and transmission electron microscopy (TEM) [2,30,31]. High spatial resolution is only achieved by SEM or TEM, but for these methods the observed processes are usually limited to (ultra)high vacuum conditions.…”

Section: Introductionmentioning

confidence: 99%

On pinning-depinning and microkink-flow in solid state dewetting: Insights by in-situ ESEM on Al thin films

et al. 2019

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The dynamics of solid state dewetting phenomena of a 50 nm thick, mazed bicrystalline Al film on single crystalline α-Al 2 O 3 (sapphire) substrates was studied in-situ using an environmental scanning electron microscope (ESEM). The bicrystalline Al thin films served as a model system where the influence of grain boundaries and texture effects are well determined compared to polycrystalline films. The experiments were performed in controlled oxidizing and reducing atmospheres at 773 K and 823 K, respectively, to shed light on the differences in dewetting mechanisms and dynamics. While the reducing atmosphere led to spontaneous dewetting at 823 K after an incubation time of a few minutes, a hierarchical dewetting process was observed for the sluggish dewetting under oxidizing conditions. Voids initiated at (substrate or surface) defects and expanded trying to maintain a hexagonal shape. Pinning and depinning processes led to a discontinuous void growth and irregular void shapes including finger instabilities. As a consequence, the void growth followed a variety of power law exponents between 0.10 and 0.55. A new microkink-flow mechanism was discovered at the terminating Al planes at the void.

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“…As a consequence, the fundamental understanding of metallic film dewetting gained more and more importance in the past years. Recently, in situ and real-time techniques have been proven to be a powerful tool for studying this phenomenon [5,6,7]. These recent works are mostly based on in situ electronic microscopies (either transmission (TEM) or scanning (SEM)) which are invaluable to understand dewetting kinetics and mechanisms at local scale.…”

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confidence: 99%

Monitoring silver solid-state dewetting with in situ ellipsometry

Jacquet

Kildemo

Teisseire

et al. 2017

Applied Surface Science

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We consider the possibility of monitoring silver solid-state dewetting with in situ Ellipsometry. We first study the optical response of partially dewetted samples in correlation with their morphological structure measured by Atomic Force Microscopy (AFM). We find that the main features observed in microscopy are identifiable in Ellipsometry spectra. Then, we analyse the dielectric function extracted from in situ measurements to predict the progression in the dewetting process. We also identify two different behaviours leading to different final states.

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Texture evolution and microstructural changes during solid-state dewetting: A correlative study by complementary in situ TEM techniques

Cited by 25 publications

References 54 publications

Elevated temperature transmission Kikuchi diffraction in the SEM

Elevated temperature transmission Kikuchi diffraction in the SEM

On pinning-depinning and microkink-flow in solid state dewetting: Insights by in-situ ESEM on Al thin films

Monitoring silver solid-state dewetting with in situ ellipsometry

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