Texture and Microstructure Evolution of Ultra-High Purity Cu-0.1Al Alloy under Different Rolling Methods

Abstract

The microstructure and texture distribution of ultra-high purity Cu-0.1Al alloy target play a key role in the quality of the sputtering film. The Cu-0.1Al alloy sheets were processed by unidirectional (UR) and cross rolling (CR), and X-ray diffraction (XRD), and electron backscatter diffraction (EBSD) technologies were adopted to observe the texture and microstructure evolution. XRD results reveal that the texture types vary greatly in UR and CR due to the change of strain path. As the strain increases to 90%, S texture occupies the most, followed by copper texture in the UR sample, while brass texture dominates the most in the CR sample. Additionally, the orientation density of texture does not increase significantly with the increase of strain but shows a downward trend both in UR and CR modes. EBSD analysis demonstrates that compared with UR, the deformation microstructure in CR is more uniform, and the layer spacing between the deformation bands is smaller, which can reduce the local-region stress concentration. After the completion of recrystallization, the difference in average grain size between the UR and CR-annealed samples is not significant, and the recrystallized grains become much finer with the increase of strain, while more equiaxed grains can be observed in CR-annealed samples.

Mitigating the Recrystallization of a Cold-Worked Cu-Al2O3 Nanocomposite via Enhanced Zener Drag by Nanocrstalline Cu-Oxide Particles

“…It is known that cold working on Cu produces a brass-type texture, which can lead to a strong 220-type reflection. Cu is known to form brass-type texture upon heavy deformation (cold working) with very strong 220 [13,14]. The major slip system in copper is {111} <110>.…”

Hot-Pressing Deformation Yields Fine-Grained, Highly Dense and (002) Textured Ru Targets

“…However, the value of (002)/(101) peak intensity ratio of Ru targets fabricated at 40 MPa is as high as 1.91, indicating the strong (002) texture. The (002) grain preferential orientation is believed to be beneficial to improving the performance of Ru targets [2,5,8]. As a result, hot-pressing deformation not only achieved a nearly fully dense and fine-grained microstructure but also induced the strong (002) texture.…”

“…These films are usually produced by magnetron sputtering of ruthenium targets, which has a significant influence on the film quality [2,[4][5][6]. The target characteristics, such as density, grain size and texture, affect the sputtering rate and the film uniformity [2,5,[7][8][9]. Therefore, it is desirable to fabricate ruthenium targets with fine grains, texture structure and full density.…”

“…Ruthenium, a brittle and hard-to-work metal, presents challenges in achieving high density through severe plastic deformation [2,23,24]. Additionally, ruthenium requires ultra-high purity as a semiconductor sputtering target, which precludes the use of additives such as sintering aids and grain growth inhibitors [2,8,25]. Consequently, ruthenium targets can only be fabricated using the "bottom-up" method.…”

The effect of severe cryogenic plastic deformation and change in strain path on nanostructured copper through multistep cross rolling

“…13,14 Change in strain path also significantly affected the texture formation of the rolled specimens. 15 The effect of cryogenic rolling combined with a change in strain path and post-annealing is least studied and hence in this research work the authors conducted cryogenic multistep cross rolling and the variations in mechanical properties, electrical conductivity, and microstructure are studied and reported.…”