Textile-based triboelectric nanogenerators via electroless plating for fabricating electrode material: Study of the relationship between electrostatic-charge density and strain in dielectric material

Fabrication of Textured Ni-Coated Carbon Tubes for a Flexible Strain Sensor: Effect of the Device Elastic Modulus on Sensor Performance

“…Because nitrogen in −NH 2 and oxygen in −OH have lone pair electrons in the hybrid orbitals. These electrons can occupy vacant electron orbitals of Pd particles. − As expected, the Pd signal is detected in elemental mapping analysis images of Pd-adsorbed cotton (Figure b II), indicating that Pd particles were successfully and uniformly disseminated over the cotton surface after the adsorptive reaction (Figure b II). H 2 PO 2 – in the E-Ni solution deoxidizes adsorbed Pd 2+ to a Pd atom (Figures S2 and 3 analysis).…”

“…We prepared a hollow conductive filler (H-T cotton) by using a simple approach coupled with E-Ni and carbonization technology. The establishment of catalytic sites on the substrate surface is key to the E-Ni implementation process. − Structural schematic illustrations of pristine, Pd-absorbed, and Ni-plated cotton are displayed in Figures a and S1a. To explore the surface characterization of the three kinds of cotton above, we performed elemental mapping analysis (as displayed in Figures b, S2, and S3); the appearance of N and O signals belong to −NH 2 and −OH (Figure b I), respectively, indicating that a large number of active groups exist on the cotton surface.…”

Fabrication of Biomaterial-Based Triboelectric Nanogenerators: Study of the Relationship between Output Performance and Strain in Dielectric Materials

“…At present, ceramic conductive films and Ag-/Cu-conducting foil-based electrode materials have been widely applied in TENG devices. ,,− The traditional electrode materials have such advantages as wear resistance, long service life, high conductivity, and so on. − With the development of ultra-intelligent devices, miniaturization, and higher surface charge density, significant research efforts have been made to develop in situ deposition of electrodes on dielectric materials without the dependence on substrate morphology and with excellent adhesion. − Electroless plating (EP) has attracted the interest of many researchers. EP is a high-efficiency and expedient metallization technique of material surface, − which prompts the autocatalytic deposition of relevant metal atoms in a solution via strong reducing agents. ,− The reducing agent in the EP reaction provides electrons to the metal atoms, which facilitate the reduction of metal ions and then deposition on the substrate surface. Wang et al, , Chen et al, Huang et al, , Gui et al, , and Zhang et al indicated that Cu and Ni particles could deposit on the polymer surface through a modified, adsorbed, and plated process, in sequence.…”

“…EP is a high-efficiency and expedient metallization technique of material surface, − which prompts the autocatalytic deposition of relevant metal atoms in a solution via strong reducing agents. ,− The reducing agent in the EP reaction provides electrons to the metal atoms, which facilitate the reduction of metal ions and then deposition on the substrate surface. Wang et al, , Chen et al, Huang et al, , Gui et al, , and Zhang et al indicated that Cu and Ni particles could deposit on the polymer surface through a modified, adsorbed, and plated process, in sequence. Active groups (−NH 2 , −OH, and −COOH) on the modified layer surface could absorb metal particles by means of covalent bonds, serving as catalytic centers for catalyzing the redox reaction in the EP solution.…”

Fabrication of Ag Complexes Based on Multidentate Ligands toward High-Efficient and Facile Electroless Plating

“…An ECP process relies on a reducing agent in the bath to contribute electrons to drive the process as metal ions react and deposit on a catalytic surface. − Unlike electroplating, the ECP process does not rely on the applied external current and conductive surface for deposition, allowing numerous independent areas to be plated simultaneously. Because of this, ECP is the pre-treatment technology of electroplating processes in some fields. ,,− What is more, ECP-deposited metal coating is homogeneous and dense with fine grains and characteristics comparable to those of electroplated metals, unlike alternatives like ink sintering that can result in high porosity and poor current carrying capacity. − To be precise, there is a trade-off between the purity, property, and quality of ECP-fabricated metal coating on the one hand and the throughput on the other hand.…”