Handbook of Fibrous Materials 2020
DOI: 10.1002/9783527342587.ch26
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Textile‐Based Electronics

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Cited by 3 publications
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“…Catalytic electroless plating is a common approach for depositing metals such as Ni, Cu, Ag, and Au on textile substrates . To address the adhesion issue between hard metals and soft textile substrates, interfacial modification between metals and textile substrates is critical. , Figure b shows a polymer-assisted metal deposition (PAMD) method for electroless metal plating. A catalyst-affinitive polymer was grafted onto the textile substrate via free-radical polymerization to serve as both seeding and adhesive layers for metals .…”
Section: Materials and Methods To Fabricate Pctsmentioning
confidence: 99%
“…Catalytic electroless plating is a common approach for depositing metals such as Ni, Cu, Ag, and Au on textile substrates . To address the adhesion issue between hard metals and soft textile substrates, interfacial modification between metals and textile substrates is critical. , Figure b shows a polymer-assisted metal deposition (PAMD) method for electroless metal plating. A catalyst-affinitive polymer was grafted onto the textile substrate via free-radical polymerization to serve as both seeding and adhesive layers for metals .…”
Section: Materials and Methods To Fabricate Pctsmentioning
confidence: 99%