Testing multichip modules

Abstract

In many cases, applying board-&pe tests using an IC tester willprove to be the most efective test methodology he advantages of implementing electronic systems as multichip modules instead of boards f d of packaged ICs are well knbwn. The compact assemblies of uncased chips and other tiny compo-Ill While simple multichip modules needing no repair can be tested by conventional chip-testnents are simultaneously smaller, lighter, ing methods, more complex ones, like this demonstration military computer system, require more reliable, and sometimes even faster that a board-test strategy be used. The module contains a 68040 microprocessor, a programmable than their printed-circuit board counter-gate array, and jive memory chips, an addition to many smaller components.

Signal Integrity: Fault Modeling and Testing in High-Speed SoCs

“…However, the ATE (automatic test equipment) speeds have always lagged behind the CUT (circuit under test) speed. As a result of this speed difference, the high-speed circuits are tested at clock rates that are much slower than their specification [25] [26]. Furthermore, the pin and probing limitations of ATEs restrict the accurate observation of test results.…”

A Novel Clock Distribution System with Injection Locked Rotary Traveling Wave Oscillator and Built-In Self-Test

“…Automatic Test Equipment (ATE) speeds have always lagged Circuit Under Test (CUT) speeds. Therefore, high-speed circuits are tested at a much lower speed than their design specifications [89], [90]. It also should be considered that the pin and probing limitations of ATEs limit the test result's accuracy.…”