1997
DOI: 10.1002/(sici)1099-1581(199709)8:9<537::aid-pat683>3.0.co;2-t
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Ternary fluoro-containing polyimide blends and fluoro-containing polyimide/polyester blends

Abstract: Two ternary miscible fluoro‐polyimide blends have been identified. They are 6FDA‐3,3′‐6F‐diamine/6FDA‐4,4′‐ F ‐ diamine/BTDA ‐ 4,4′ ‐ 6FDA blend and 6FDA ‐ 3,3′ ‐ 6F ‐ diamine/6FDA ‐ 4,4′ ‐ 6F ‐ diamine/ODPA ‐ PMDA ‐ 4,4′‐6F‐diamine blend (6FDA is 2,2′‐bis(3,4′‐dicarboxy‐ phenyl)hexafluoro propane dianhydride, 6F‐diamine is 2,2′‐bis(3‐aminophenyl) hexafluoro propane). Their miscibility probably arises from the fact that their diamine parts have hexafluoro isopropylidene groups, their dianhydride parts have sim… Show more

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Cited by 3 publications
(2 citation statements)
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“…This T g is between the T g s of Psf (186°C) and Matrimid (320°C), which is indicative of the existence of a miscible blend at the interface. The composition of possible blending calculated based on Fox equation (shown in Figure 10)33 are 0.45/0.55 to 0.38/0.62 of Psf/Matrimid (weight ratio). Fourier transform infrared (FTIR) spectra in Figure 11 display wavelength shifts of the imide CO group (from 1715 to 1719 cm −1 ), and the CNC group (from 1092 to 1098 cm −1 ) because of molecular interactions.…”
Section: Resultsmentioning
confidence: 99%
“…This T g is between the T g s of Psf (186°C) and Matrimid (320°C), which is indicative of the existence of a miscible blend at the interface. The composition of possible blending calculated based on Fox equation (shown in Figure 10)33 are 0.45/0.55 to 0.38/0.62 of Psf/Matrimid (weight ratio). Fourier transform infrared (FTIR) spectra in Figure 11 display wavelength shifts of the imide CO group (from 1715 to 1719 cm −1 ), and the CNC group (from 1092 to 1098 cm −1 ) because of molecular interactions.…”
Section: Resultsmentioning
confidence: 99%
“…[1][2][3][4][5][6][7][8][9][10] In addition, PI hybrids are often able to overcome severe thermal and mechanical stress concentration and associated reliability problems produced by the mismatch in coefficient of thermal expansion (CTE) and modulus between polymers, ceramics, or metals. [11][12][13][14][15][16][17][18] These improvements enable PIs to meet some ultimate requirements in demanding applications such as highly rapid speed-up circuits and complex multilayer devices.…”
Section: Introductionmentioning
confidence: 99%