“…The capabilities of mid-infrared photodetection are highly desirable for many applications such as spectroscopy, chemical and biomolecular sensing, infrared imaging, night vision, security, and industry. , Silicon (Si) photodetectors based on complementary metal-oxide-semiconductor (CMOS) technology are of low cost and have maturity, high performance, and high level of integration with electronics from the deep ultraviolet (UV) to near-infrared (IR) region. Photodetection beyond the near-IR region typically is based on either thermal photodetection (i.e., pyroelectric, bolometer, thermocouple, and thermopile detectors), narrow band gap semiconductors (i.e., InSb, InGaAs, and HgCdTe detectors), or photoionization of shallow impurities (i.e., block-impurity bands using Si:Ga, Si:B, and GaAs:Te detectors). − Thermal photodetectors have low sensitivity, have a long response time, and often require human intervention. The other photodetectors require cryogenic operation and complicated fabrication processes that are only accessible for small-volume and high-value markets and cannot compensate for the demands of markets such as Si detectors.…”