Terabit/s-Class Optical PCB Links Incorporating 360-Gb/s Bidirectional 850 nm Parallel Optical Transceivers

Doany, F. E.; Schow, Clint L.; Lee, B. G.; Budd, R.; Baks, Christian; Tsang, C. K.; Knickerbocker, John; Dangel, R.; Chan, Benson; Lin, How; Carver, Chase; Huang, Jianzhuang; Berry, J.; Bajkowski, D.; Libsch, F.; Kash, J. A.

doi:10.1109/jlt.2011.2177244

Cited by 92 publications

(31 citation statements)

References 16 publications

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“…Furthermore, the pitch of the waveguides on the board is typically fabrication limited and hence cannot be scaled to very fine Fig. 1(c) shows the schematic of terabus architecture with polymer waveguides at the board level fabricated at a 62.5 µm pitch [9,10]. A silicon based 'optical chip' converts the electrical signals to optical signal which is then relayed to the motherboard via a lens array and optical couplers.…”

Section: Current Methodologiesmentioning

confidence: 99%

“…A silicon based 'optical chip' converts the electrical signals to optical signal which is then relayed to the motherboard via a lens array and optical couplers. The terabus has been shown to provide a bidirectional aggregate data rate of 360 Gb/s bandwidth over 24 transmitter and 24 receiver channels with polymer waveguide on the optical printed circuit board (PCB) with each channel operating at 15 Gb/s and a link EPB of 9.7 pJ/bit [10]. This translates to a bandwidth density of ∼240 Gb/s/mm.…”

Section: Current Methodologiesmentioning

confidence: 99%

See 1 more Smart Citation

Chip-to-chip interconnect integration technologies

Zia

Zhang

Yang

et al. 2016

IEICE Electron. Express

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With continuous increase in the off-chip bandwidth requirements, conventional interconnection methodologies are quickly becoming incapable of meeting the demand. Recent progress in silicon interposer and 3D integration technologies seek to alleviate some of these bottlenecks. This paper reviews the evolution of conventional interconnect methodologies and recent progress in platforms allowing high-bandwidth low-energy chip-tochip communication.

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Section: Current Methodologiesmentioning

confidence: 99%

Section: Current Methodologiesmentioning

confidence: 99%

Chip-to-chip interconnect integration technologies

Zia

Zhang

Yang

et al. 2016

IEICE Electron. Express

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show abstract

“…For optical PCB's, the integration allows a high optical data transfer rate up to Terabit/s. [1][2][3] Apart from communication tasks, the sensing properties of optical waveguides 4 are also used for surface and structure health monitoring allowing a local distributed measurement of temperature and strain changes. [5][6][7][8][9] Another trend in scientific work is the development of innovative production methods such as flexography 10 or Inkjet 11 printing.…”

Section: Introductionmentioning

confidence: 99%

Functionalization of UV-curing adhesives for surface-integrated micro-polymer optical fibers

Hachicha

Overmeyer

2016

Integrated Optics: Devices, Materials, and Technologies XX

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Polymer optical waveguides, especially single-mode waveguides are increasingly used for short distance communication, as well as for sensing applications. The realization of a working communication route requires different and sequentially realized steps. Generally, these steps are the packaging of semiconductor beam senders and receivers, the fabrication of an optical waveguide, the preparation of its end-facets, the alignment of different elements along their optical axis and the integration into a desired communication route. The development of a process, which integrates all these steps for planar surfaces, offers a reduction in time and an increase in flexibility. A sub-step toward such a highly automated system is the integration of optical waveguides into the planar surface. In this context, we are investigating the use of the micro-dispensing process to realize this integration step. We functionalize UV-curing adhesives as cladding for micro-optical cores as well as for inherent bonding to the substrate surface. For this purpose an optical characterization of the adhesives is necessary for an adequate core and cladding material combination. A flow behavior characterization is also relevant in order to analyze the used dispensing process with the selected adhesive. Finally, a mechanical characterization is done to test the adhesion of the core to the adhesive, as well as the adhesive to the substrate surface. In this paper we present a summary of the realized characterization of the selected polymer. Based on experiment results we infer limits and opportunities of this method.

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“…A bundle of fibers is also bulky and difficult to handle, much like electrical wiring before the invention of the printed circuit board (PCB). The solution to this problem is envisioned in the development the optical equivalent; the optical printed circuit board or O-PCB [3]. This would consist of a board pre-printed with an arrangement of waveguides that would serve as the communication channels between chips.…”

Section: Introductionmentioning

confidence: 99%

Toolkit for Photonic Integrated Circuits Based on Inverted Rib Waveguides

Debnath

Moore

Liles

et al. 2015

J. Lightwave Technol.

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Abstract-We have performed an exploration of inverted rib waveguide platform for use in optical backplanes. This entailed the design, optimization, and characterization of a variety of passive optical components that may serve as a basis for the functions required of an on-chip optical networks. The presented design introduces an inverted-rib template which consists of a polymer waveguide layer. We have successfully fabricated and demonstrated low-loss waveguides, and also functional passive devices such as directional couplers, multi-mode interferometers, waveguide bends and crossings, and distributed Bragg reflectors. We also demonstrate a way of coupling active components (e.g. in silicon) to such a photonic integrated circuit.Index Terms-Optical backplane, opto-electronic integration, polymer waveguide, passive optical components.

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Terabit/s-Class Optical PCB Links Incorporating 360-Gb/s Bidirectional 850 nm Parallel Optical Transceivers

Cited by 92 publications

References 16 publications

Chip-to-chip interconnect integration technologies

Chip-to-chip interconnect integration technologies

Functionalization of UV-curing adhesives for surface-integrated micro-polymer optical fibers

Toolkit for Photonic Integrated Circuits Based on Inverted Rib Waveguides

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