Tensile testing of silicon film having different crystallographic orientations carried out on a silicon chip

Sato, Kazuo; Yoshioka, Takahito; Ando, Tetsu; Shikida, Mitsuhiro; Kawabata, Tatsuo

doi:10.1016/s0924-4247(98)00125-3

Cited by 142 publications

(73 citation statements)

References 2 publications

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“…60 For micrometer-sized Si samples of 20-30 m in thickness, 100 m in width and 400 m in length, fracture strain and Young's modulus along the ͗100͘ direction are 0.015 and 140 GPa. 61 This Young's modulus is also similar to the calculated values according to Brantley 60 and the strength of the micrometer-sized samples is estimated to be 2.1 GPa. 62 Another important direction for the deformation is the ͗110͘.…”

Section: Resultssupporting

confidence: 86%

“…63 In this experiment, the strength of the single crystalline nanowire increases to twice of that of the micrometer-sized samples. 61 The strength of crystals is determined by defect generation and evolution. 4,5 In particular in Si, pre-existing defects act as origins for cracks.…”

Section: Resultsmentioning

confidence: 99%

“…13, On the other hand, experiments on the mechanical properties have only been conducted on submicrometer scales. [59][60][61][62][63][64][65] In this paper, we demonstrate the mechanics of materials for Si wires of nanometer width, protruding from nanometer Si tips into a vacuum using the in situ TEM.…”

Section: Introductionmentioning

confidence: 99%

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Measurements of the atomistic mechanics of single crystalline silicon wires of nanometer width

et al. 2005

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Tensile deformation behavior of silicon ͑Si͒ wires with nanometer widths, synthesized by nanometer-tip contact and successive retraction, was studied by atomistic combined microscopy of high-resolution transmission electron microscopy/scanning probe microscopy. The elastic limit, Young's modulus, and strength of individual Si nanowires were investigated based on the mechanics of materials at an atomic scale. It was found that both Young's modulus and strength increased to 18± 2 and 5.0± 0.3 GPa, respectively. The elastic limit was 0.10± 0.02 and fracture strain was estimated to be 0.30± 0.01. Experimental results show that mechanical properties of Si wires transform due to size reduction from micrometer to nanometer scale.

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Section: Resultssupporting

confidence: 86%

Section: Resultsmentioning

confidence: 99%

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Measurements of the atomistic mechanics of single crystalline silicon wires of nanometer width

et al. 2005

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“…Figure 3g,h shows microscale X-ray coherent tomography (microXCT, see Supplementary Note 1) images of the samples, along with corresponding FEM results. The findings indicate that the all-vertical and half-and-half structures can be elastically strained by 105% and 63%, respectively, given a maximum principal strain of 1% in the silicon 31 . The fracture points measured electrically from half-andhalf structures ( Supplementary Fig.…”

Section: Resultsmentioning

confidence: 94%

Fractal design concepts for stretchable electronics

et al. 2014

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Stretchable electronics provide a foundation for applications that exceed the scope of conventional wafer and circuit board technologies due to their unique capacity to integrate with soft materials and curvilinear surfaces. The range of possibilities is predicated on the development of device architectures that simultaneously offer advanced electronic function and compliant mechanics. Here we report that thin films of hard electronic materials patterned in deterministic fractal motifs and bonded to elastomers enable unusual mechanics with important implications in stretchable device design. In particular, we demonstrate the utility of Peano, Greek cross, Vicsek and other fractal constructs to yield space-filling structures of electronic materials, including monocrystalline silicon, for electrophysiological sensors, precision monitors and actuators, and radio frequency antennas. These devices support conformal mounting on the skin and have unique properties such as invisibility under magnetic resonance imaging. The results suggest that fractal-based layouts represent important strategies for hard-soft materials integration.

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“…In the following, we begin with the stress distribution in smooth nanobeams followed by the effect of surface (110), Bhushan & Venkatesan (1993). b Johansson et al (1988), Ericson & Schweitz (1990), Wilson & Beck (1996), , Sharpe et al (1997), Sato et al (1998), Tsuchiya et al (1998), Greek et al (1999) and Yi et al (2000). c Johansson et al (1989), Ballarini et al (1997), Kahn et al (1999) and Fitzgerald et al (2000).…”

Section: Finite-element Analysis Of Nanostructures With Roughness Andmentioning

confidence: 99%

Nanotribology and nanomechanics in nano/biotechnology

Bhushan

2008

Phil. Trans. R. Soc. A.

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Owing to larger surface area in micro/nanoelectromechanical systems (MEMS/NEMS), surface forces such as adhesion, friction, and meniscus and viscous drag forces become large when compared with inertial and electromagnetic forces. There is a need to develop lubricants and identify lubrication methods that are suitable for MEMS/NEMS. For BioMEMS/BioNEMS, adhesion between biological molecular layers and the substrate, and friction and wear of biological layers may be important, and methods to enhance adhesion between biomolecules and the device surface need to be developed. There is a need for development of a fundamental understanding of adhesion, friction/stiction, wear, the role of surface contamination and environment, and lubrication. MEMS/NEMS materials need to exhibit good mechanical and tribological properties on the micro/nanoscale. Most mechanical properties are known to be scale dependent. Therefore, the properties of nanoscale structures need to be measured. Componentlevel studies are required to provide a better understanding of the tribological phenomena occurring in MEMS/NEMS. The emergence of micro/nanotribology and atomic force microscopy-based techniques has provided researchers with a viable approach to address these problems. This paper presents an overview of micro/nanoscale adhesion, friction, and wear studies of materials and lubrication studies for MEMS/NEMS and BioMEMS/BioNEMS. It also presents a review of scale-dependent mechanical properties, and stress and deformation analysis of nanostructures.

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Tensile testing of silicon film having different crystallographic orientations carried out on a silicon chip

Cited by 142 publications

References 2 publications

Measurements of the atomistic mechanics of single crystalline silicon wires of nanometer width

Measurements of the atomistic mechanics of single crystalline silicon wires of nanometer width

Fractal design concepts for stretchable electronics

Nanotribology and nanomechanics in nano/biotechnology

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