Tensile Strength of Silicon Nanowires Batch-Fabricated into Electrostatic MEMS Testing Device

Tsuchiya, Toshiyuki; Hemmi, Tetsuya; Suzuki, Junya; Hirai, Yoshikazu; Tabata, Osamu

doi:10.3390/app8060880

Cited by 25 publications

(12 citation statements)

References 28 publications

(33 reference statements)

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“…The modulus of elasticity obtained in this work is comparable with those previously reported in the range of 70 GP a to 100 GP a for top-down fabricated Si NWs with similar size and crystal orientation [22,23]. A higher modulus of elasticity of 160 GP a to 230 GP a is reported for Si NWs under tensile tests [24]. This can be linked to surface elasticity, surface defects and native oxide effects [3].…”

Section: Resultssupporting

confidence: 88%

A new characterization approach to study the mechanical behavior of silicon nanowires

et al. 2021

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Section: Resultssupporting

confidence: 88%

A new characterization approach to study the mechanical behavior of silicon nanowires

et al. 2021

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“…In this case, the system can generate a large force despite of a small displacement due to a large change of the total comb capacitance. [ 18 ] We also use a well‐known bowtie structure for the suspended gold bridge to precisely define the position of the fracture and gap formation. [ 19 ] Typically, the constriction of the narrowest gold bridge was 300–500 nm wide and 200 nm thick which requires a tensile force of 22 µN to cause breakdown.…”

Section: Resultsmentioning

confidence: 99%

An On‐Chip Break Junction System for Combined Single‐Molecule Conductance and Raman Spectroscopies

Jeong

Domulevicz

2020

Adv Funct Materials

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Systems that are capable of robustly reproducing single-molecule junctions are an essential prerequisite for enabling the wide-spread testing of molecular electronic properties, the eventual application of molecular electronic devices, and the development of single-molecule based electrical and optical diagnostics. Here, a new approach is proposed for achieving a reliable single-molecule break junction system by using a microelectromechanical system device on a chip. It is demonstrated that the platform can (i) provide subnanometer mechanical resolution over a wide temperature range (≈77-300 K), (ii) provide mechanical stability on par with scanning tunneling microscopy and mechanically controllable break junction systems, and (iii) operate in a variety of environmental conditions. Given these fundamental device performance properties, the electrical characteristics of two standard molecules (hexane-dithiol and biphenyl-dithiol) at the singlemolecule level, and their stability in the junction at both room and cryogenic temperatures (≈77 K) are studied. One of the possible distinctive applications of the system is demonstrated, i.e., observing real-time Raman scattering in a single-molecule junction. This approach may pave a way to achieving high-throughput electrical characterization of single-molecule devices and provide a reliable platform for the convenient characterization and practical application of single-molecule electronic systems in the future.

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“…The different types of microwires are used in MEMS technology for sensing temperature, actuation of micro-actuators, sensors, and also in the medical field for orthodontic purposes [6,8]. The most commonly used microwire in MEMS technology is made of copper [7], NiTi [8], platinum [9], glass-coated magnetic microwire [10], silicon microwire [11,12], aluminum, gold microwire, etc. [13].…”

Section: Introductionmentioning

confidence: 99%

Numerical analysis of reaction forces at the supports of sliding microwire

Rahman

Akanda

2022

JMES

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The reaction forces at the tungsten support probes of a platinum microwire are determined by numerical analysis for different push-pull sliding velocities and contact pressures. The Finite Element Analysis (FEA) tool ANSYS Workbench is used to evaluate the contact stresses, reaction forces and deformations of the platinum microwire. The nonlinear contact analysis and contact formulations are implemented to ensure that the platinum microwire maintained contact with the tungsten support probes during push-pull sliding motion, and transfer frictional forces between contact surfaces without penetration and separation. The reaction forces at the support probes are found independent of the sliding velocity of the platinum microwire and vary with normal contact pressure. The results found in the numerical analysis are validated through experimental works. Due to the tiny size, the nonlinearity of contacts and indeterminate supports criteria, it is difficult to determine the reaction forces at the supports of a sliding microwire by conventional mechanics. The method of the numerical analysis of the sliding microwire presented in this paper can be used to determine the reaction forces of other microstructures, validate the experimental results, as well as to evaluate total disturbance forces in the microstructures where relative motion exists; which are important for the proper design and failure analysis of the MEMS devices and microstructures.

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Tensile Strength of Silicon Nanowires Batch-Fabricated into Electrostatic MEMS Testing Device

Cited by 25 publications

References 28 publications

A new characterization approach to study the mechanical behavior of silicon nanowires

A new characterization approach to study the mechanical behavior of silicon nanowires

An On‐Chip Break Junction System for Combined Single‐Molecule Conductance and Raman Spectroscopies

Numerical analysis of reaction forces at the supports of sliding microwire

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