Tensile properties of in situ consolidated nanocrystalline Cu

Cheng, Sheng; Ma, Evan; Wang, Y.M.; Kecskes, Laszlo J.; Youssef, Khaled M.; Koch, Carl C.; Trociewitz, U.P.; Han, Ke

doi:10.1016/j.actamat.2004.12.005

Cited by 445 publications

(191 citation statements)

References 51 publications

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“…The line is used to demarcate the ductility versus strength trade-off for most nanocrystalline Cu studies in the literature 121,[135][136][137][138][139] (versus coarse-grain copper 140,141 ). However, several studies used microstructure design and consolidation to push the strength and ductility beyond this limit 134,140,143,144 Despite the ability to push the strength and ductility, these nanocrystalline and highly twinned microstructures still have problems with either thermal stability and/or scalability to bulk dimensions due to the processing method used.…”

Section: Ductilitymentioning

confidence: 99%

“…However, several recent advances in microstructure design and consolidation are pushing the strength and ductility beyond this limit, e.g., bimodal nanocrystalline/coarse-grained Cu, 142 nanotwinned Cu, 143 ''artifact-free'' nanocrystalline Cu, 144 and cryomilled in situ consolidation of Cu. 134 Fig. 8.…”

Section: Ductilitymentioning

confidence: 99%

“…In the past, quite frequently porosity from incomplete densification was still an issue with this technique. However, within the last decade, there are increasingly more examples and strategies for obtaining bulk, fully densified nanocrystalline materials produced via ball milling; 133 subsequent consolidation demonstrates that these materials can possess good ductilities while retaining much of the strength of nanocrystalline materials 119,122,134 (i.e., 14% tensile ductility or potentially higher in Refs. 119,122).…”

Section: Ductilitymentioning

confidence: 99%

“…10 shows the strain-rate sensitivity m as a function of grain size for a range of grain sizes from nanocrystalline to coarse grained and for a number of different processing methods. 108,126,134,137,[149][150][151][152][153][154][155][156][157][158][159] The coefficient m increases with decreasing grain size. Moreover, this plot shows that the strain-rate sensitivities are as high as 3-4 times higher for ultrafine-grained Cu than for coarse-grained Cu and are as high as 6-8 times higher for nanocrystalline materials than for coarse-grained Cu.…”

Section: Strain-rate Sensitivity (And Activation Volume)mentioning

confidence: 99%

“…The strain-rate sensitivity m increases with decreasing grain size for copper processed by a number of different methods. The different grain sizes are categorized into nanocrystalline ( <100 nm), ultrafine grained (100 nm to 1lm), and coarse grained (>1 lm) for various studies 108,126,134,137,[149][150][151][152][153][154][155][156][157][158][159] ''Bulk'' Nanocrystalline Metals: Review of the Current State of the Art and Future Opportunities for Copper and Copper Alloys…”

Section: Strain-rate Sensitivity (And Activation Volume)mentioning

confidence: 99%

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“Bulk” Nanocrystalline Metals: Review of the Current State of the Art and Future Opportunities for Copper and Copper Alloys

Tschopp

Murdoch

Kecskes

et al. 2014

JOM

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It is a new beginning for innovative fundamental and applied science in nanocrystalline materials. Many of the processing and consolidation challenges that have haunted nanocrystalline materials are now more fully understood, opening the doors for bulk nanocrystalline materials and parts to be produced. While challenges remain, recent advances in experimental, computational, and theoretical capability have allowed for bulk specimens that have heretofore been pursued only on a limited basis. This article discusses the methodology for synthesis and consolidation of bulk nanocrystalline materials using mechanical alloying, the alloy development and synthesis process for stabilizing these materials at elevated temperatures, and the physical and mechanical properties of nanocrystalline materials with a focus throughout on nanocrystalline copper and a nanocrystalline Cu-Ta system, consolidated via equal channel angular extrusion, with properties rivaling that of nanocrystalline pure Ta. Moreover, modeling and simulation approaches as well as experimental results for grain growth, grain boundary processes, and deformation mechanisms in nanocrystalline copper are briefly reviewed and discussed. Integrating experiments and computational materials science for synthesizing bulk nanocrystalline materials can bring about the next generation of ultrahigh strength materials for defense and energy applications.

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