Tensile properties of free-standing aluminum thin films

Read, David T.; Cheng, Yi‐Wen; Keller, Robert R.; McColskey, Joseph D.

doi:10.1016/s1359-6462(01)01067-3

Cited by 91 publications

(53 citation statements)

References 12 publications

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“…It was reported, however, that the elastic modulus measured by a cantilever microbeam test was close to that in the parallel direction to the film surface [23]. The bulk property of pure Al is 65-70 GPa in general [24], but the Young's moduli of Al in the form of a thin-film from literature [3,7,11,[24][25][26][27][28][29][30][31][32][33] lie mostly between 55 and 81 GPa, as shown in Figure 9. Outliers are observed such that the results reported by Reddy et al [7] using a lateral resonator show very large scatter from 33 to 102 GPa.…”

Section: Discussionmentioning

confidence: 86%

“…The reason was attributed to geometrical effects from microfabrication issues, such as the scalloping of the beam width during a deep reactive ion etching process. Read et al [26] also reported an elastic modulus of 24.2-30.0 GPa, which is less than half the bulk property, from tensile tests on free-standing Al specimens. Although it was pointed out that variations in chemical composition, heat treatment, and grain size had little influence on the result, the main reason was not clarified in their study.…”

Section: Discussionmentioning

confidence: 99%

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A Comparative Study on the Elastic Characteristics of an Aluminum Thin-Film Using Laser Optical Measurement Techniques

2017

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Abstract:The increase of a surface area-to-volume ratio with the reduction of material dimensions significantly alters the characteristics of materials from their macroscopic status. Therefore, efforts have been made to establish evaluation techniques for nanoscale films. While contact mechanics-based techniques are conventionally available, non-contact and nondestructive methods would be preferable in case damages left on a sample after testing are not desirable, or an in situ assessment is required. In the present study, the Young's modulus of an aluminum thin-film was evaluated using two different laser optical measurement techniques. First, microscale beam testing has been performed so that the resonant frequency change of a microfabricated cantilever beam induced by coating of a 153 nm thick aluminum layer on its top surface can be detected using a laser interferometer in order to evaluate the mechanical property through modal analysis using the finite element method. Second, picosecond ultrasonics were employed for cross-verification so that the mechanical characteristics can be evaluated through the investigation of the longitudinal bulk wave propagation behavior. Results show that the Young's moduli from both measurements agree well with each other within 3.3% error, proving that the proposed techniques are highly effective for the study of nanoscale films.

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Section: Discussionmentioning

confidence: 86%

Section: Discussionmentioning

confidence: 99%

A Comparative Study on the Elastic Characteristics of an Aluminum Thin-Film Using Laser Optical Measurement Techniques

2017

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“…To ensure that the load is transferred along the specimen's axis, a square-pinned gripper is inserted into a hole at the specimen's free end, matching a triangle centered on the specimen's axis (for design and fabrication details see section 4.2). This improves the original pin-in-hole gripper proposed in [54] or any other mechanical locking, because only a force and no moment can be transferred at a single point that is well aligned with the specimen axis. Therefore, misalignment effects are reduced to rotational effects only.…”

Section: Design Principlementioning

confidence: 90%

“…To ensure an adequate fixture, grippers combined with (photocurable) adhesives [50,51], have been proposed, while at the nanoscale electron/ ion beam lithography concepts were used [52]. Alternatives are electro-static clamping [53] and mechanical locking via pin-in-hole [54] or geometries that conform to the gauge-end [55]. However, in all cases careful provisions for specimen alignment are necessary [56][57][58][59][60][61][62].…”

Section: Design Principlementioning

confidence: 99%

On-wafer time-dependent high reproducibility nano-force tensile testing

Bergers¹,

Hoefnagels²,

Geers³

2014

J. Phys. D: Appl. Phys.

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Time-dependent mechanical investigations of on-wafer specimens are of interest for improving the reliability of thin metal film microdevices. This paper presents a novel methodology, addressing key challenges in creep and anelasticity investigations through on-wafer tensile tests, achieving highly reproducible force and specimen deformation measurements and loading states. The methodology consists of a novel approach for precise loading using a pinin-hole gripper and a high-precision specimen alignment system based on three-dimensional image tracking and optical profilometry resulting in angular alignment of <0.1 mrad and near-perfect co-linearity. A compact test system enables in situ tensile tests of on-wafer specimens under light and electron microscopy. Precision force measurement over a range of 0.07 µN to 250 mN is realized based on a simple drift-compensated elastically-hinged load cell with high-precision deflection measurement. The specimen deformation measurement, compensated for drift through image tracking, yields displacement reproducibility of <6 nm. Proof of principle tensile experiments are performed on 5 µm-thick aluminum-alloy thin film specimens, demonstrating reproducible Young's modulus measurement of 72.6 ± 3.7 GPa. Room temperature creep experiments show excellent stability of the force measurement and underline the methodology's high reproducibility and suitability for time-dependent nanoforce tensile testing of on-wafer specimens.

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“…In this version, the specimen width is around 10 μm and the gage length is around 200 μm, while the thickness remains near 1 μm, Figure 4.13 [68]. The surface micromachining concept is used; the substrate is removed to a depth of around 100 μm beneath the specimen, using xenon difluoride.…”

Section: Microtensile Testingmentioning

confidence: 99%

Thin Films for Microelectronics and Photonics: Physics, Mechanics, Characterization, and Reliability

Read

Volinsky

Micro- And Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging

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Tensile properties of free-standing aluminum thin films

Cited by 91 publications

References 12 publications

A Comparative Study on the Elastic Characteristics of an Aluminum Thin-Film Using Laser Optical Measurement Techniques

A Comparative Study on the Elastic Characteristics of an Aluminum Thin-Film Using Laser Optical Measurement Techniques

On-wafer time-dependent high reproducibility nano-force tensile testing

Thin Films for Microelectronics and Photonics: Physics, Mechanics, Characterization, and Reliability

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