Tensile creep characteristics of Sn–3.5Ag–0.5Cu (SAC355) solder reinforced with nano-metric ZnO particles

Fawzy, A.; Fayek, S.A.; Sobhy, Mohammed; Nassr, E.; Mousa, Mohammad; Saad, Gamal R.

doi:10.1016/j.msea.2014.02.061

Cited by 57 publications

(32 citation statements)

References 34 publications

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“…The slight increase in melting point of the SSC-ZnO composite solder can be attributed to the effect of the nano-sized ZnO particles on the rate of solidification. Such particles may serve as retardation sites for the solidification process of the IMCs [22].…”

Section: Thermal Behaviormentioning

confidence: 99%

Influence of ZnO nano-particles addition on thermal analysis, microstructure evolution and tensile behavior of Sn–5.0wt% Sb–0.5wt% Cu lead-free solder alloy

Fouda

Eid

2015

Materials Science and Engineering: A

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Section: Thermal Behaviormentioning

confidence: 99%

Influence of ZnO nano-particles addition on thermal analysis, microstructure evolution and tensile behavior of Sn–5.0wt% Sb–0.5wt% Cu lead-free solder alloy

Fouda

Eid

2015

Materials Science and Engineering: A

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“…In spite of having these properties, recently increased environmental and human health concerns over the toxicity of lead and lead-containing compounds have banned the use of Sn-Pb solder alloys . This has promoted the development of new lead free solder alloys to meet its increased demand in modern technology (Fawzy et al 2014). The potential lead free solders should ensure the melting temperature similar to that of Sn-Pb solders combined with low cost, good solderability, adequate mechanical strength and good corrosion resistance (Billah et al 2014).…”

Section: Introductionmentioning

confidence: 99%

Electrochemical Corrosion Behaviour of Pb-free SAC 105 and SAC 305 Solder Alloys: A Comparative Study

Fayeka¹,

Haseeb²,

Fazal³

2017

JSM

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Sn-Ag based solder alloy seems to be a promising lead-free solder for the application on electronic assembly. The corrosion behavior of different lead free solder alloys such as Aloi pateri berasaskan Sn-Ag berpotensi menjadi pateri bebas-Pb untuk diaplikasikan sebagai pemasangan elektronik. Tindak balas kakisan aloi pateri bebas Pb yang berbeza seperti dikaji dalam larutan 3.5% NaCl menggunakan upaya dinamik pengutuban dan spektroskopi impedans elektrokimia. Mikroskop imbasan elektron (SEM), spektroskopi sinar-X tenaga terserak (EDX) dan pembelauan sinar-X (XRD) telah digunakan

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“…Electronic packaging engineers face these challenges for two main reasons: firstly, they need to include new and more powerful functions into a smaller and thinner products, which lead to higher current density [3,4] and, secondly the employment of lead-free interconnects, components and printed circuit board (PCB) that increase the complexity of the interconnection metallurgy and reliability [5,6]. Generally, in electronic packaging system, electronic components i.e., transistors, integrated circuit (IC), chips etc.…”

Section: Introductionmentioning

confidence: 99%

Effect of thin gold/nickel coating on the microstructure, wettability and hardness of lead-free tin–bismuth–silver solder

Gain

Zhang

2016

J Mater Sci: Mater Electron

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This paper investigates the coating thickness and surface morphology of gold/nickel (Au/Ni) layer on copper (Cu) substrate. A cross-sectioned SEM analysis confirmed that the Au/Ni coating was uniform. The top Au layer with average thickness of 0.7 lm appeared to have a very smooth surface without any defect such as cracks and delamination. However, the thin Au/Ni coating greatly influenced the interfacial structure and material properties of electronic interconnections. In the reference Cu substrate/Sn-Bi-Ag solder system, an island-shaped Cu 6 Sn 5 IMC layer at the interface could be clearly observed at the initial reaction stage. After a prolong reaction, a very thin Cu 3 Sn IMC layer was formed with excessive growth of the Cu 6 Sn 5 IMC layer which can deteriorate the electronic interconnection life-span. However, in the Au/Ni coated substrate/solder system, a very thin scallop-shaped ternary Ni 3 Sn 4 IMC layer formed without the Cu 3 Sn IMC layer, indicating that the Au/Ni coating hindered the growth of the IMC layer, which consequently changed the activation energies and refined the microstructure. Additionally, the overall micro-hardness of the Au/Ni coated substrate/solder system is higher than that of the reference solder system.

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Tensile creep characteristics of Sn–3.5Ag–0.5Cu (SAC355) solder reinforced with nano-metric ZnO particles

Cited by 57 publications

References 34 publications

Influence of ZnO nano-particles addition on thermal analysis, microstructure evolution and tensile behavior of Sn–5.0wt% Sb–0.5wt% Cu lead-free solder alloy

Influence of ZnO nano-particles addition on thermal analysis, microstructure evolution and tensile behavior of Sn–5.0wt% Sb–0.5wt% Cu lead-free solder alloy

Electrochemical Corrosion Behaviour of Pb-free SAC 105 and SAC 305 Solder Alloys: A Comparative Study

Effect of thin gold/nickel coating on the microstructure, wettability and hardness of lead-free tin–bismuth–silver solder

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