Tensile and mixed-mode strength of a thin film-substrate interface under laser induced pulse loading

Wang, Junlan; Sottos, Nancy R.; Weaver, Richard L.

doi:10.1016/j.jmps.2003.09.029

Cited by 51 publications

(43 citation statements)

References 47 publications

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“…Besides longitudinal stress pulses also shear pulses can be obtained by using a triangular fused silica prism for partial mode conversion of the excited longitudinal compressive wave into a shear wave upon oblique incidence onto a surface, as illustrated in Fig. 2 (Wang et al, 2003b;Wang et al, 2004;Kitey et al, 2009). With an optimized setup, nearly complete conversion into high amplitude shear pulses, and therefore mode-II fracture by in-plane shear stress, can be achieved at a prism angle of θ = 57.7° .…”

Section: Methodsmentioning

confidence: 99%

“…Numerical simulations are needed to obtain a more accurate description of the threedimensional evolution of the stress field. The treatment of the more complicated mixed-mode case, where tensile and shear stresses act simultaneously, can be found in several publications (Wang et al, 2003b); Wang et al, 2004;Kitey et al, 2009). In these reports the equations have been derived that are needed to extract the interfacial adhesion strengths for mixed-mode failure and to compare these results with those for purely tensile loading.…”

mentioning

confidence: 99%

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Laser-based Determination of Decohesion and Fracture Strength of Interfaces and Solids by Nonlinear Stress Pulses

Hess¹

2010

Acoustic Waves

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Section: Methodsmentioning

confidence: 99%

mentioning

confidence: 99%

Laser-based Determination of Decohesion and Fracture Strength of Interfaces and Solids by Nonlinear Stress Pulses

Hess¹

2010

Acoustic Waves

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“…At a critical stress level, the interface fails and the film spalls from the substrate. The spallation protocol has been used to characterize the tensile and mixed-mode strength of a wide range of thin film interfaces (Kandula et al 2008a;Kimberly et al 2008;Kitey et al 2009;Wang et al 2002Wang et al , 2004Hu and Wang 2006;Gupta and Yuan 1993;Gupta et al 1994). Recent efforts have been made to adapt laserspallation based techniques for measurement of interfacial fracture toughness.…”

Section: Introductionmentioning

confidence: 99%

Dynamic delamination of patterned thin films: a numerical study

et al. 2010

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We present an analytical investigation of a test protocol recently developed to extract the fracture toughness of thin films used in microelectronics and other engineering applications. The testing method involves the dynamic delamination of patterned thin films initiated by a laser-induced pressure pulse applied on the backside of the substrate. The kinetic energy imparted by the pulse to a weakly bonded (pre-cracked) region of the film is converted into fracture energy as the thin film delaminates in a controlled fashion over multiple milimeters. To support these experiments and extract the interface fracture toughness values, we develop a numerical scheme based on the combination of a nonlinear beam model used to capture the elastodynamic response of the thin film and a cohesive failure model to simulate the spontaneous propagation of the delamination front. The accuracy of the beam model is assessed through a comparison with the results of a more complex 2D hybrid spectral/finite element scheme. Numerical results are compared with experimental measurements of the delamination length and the outcome of a parametric study of some of the key geometrical and loading quantities defining the delamination event is presented.

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“…Comparing to the other existing thin film adhesion measurement techniques such as peel, pull, scratch, and blister tests [1], laser induced thin film spallation technique has the unique advantage of applying a well-controlled stress state at the thin film/substrate interface in a non-contact manner [2][3][4][5][6][7]. In this technique, controlled debonding of a test film is achieved through the impact of a high-energy stress wave of nanoseconds duration.…”

Section: Introductionmentioning

confidence: 99%

Pure-shear Failure of Thin Films by Laser-induced Shear Waves

Wang

2006

Exp Mech

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The measurement of mode-dependent thin film interfacial properties is important in evaluating the quality of the interfaces between thin films and substrates. Previous work has proved that tensile and mixed-mode strength of a thin film/substrate interface can be evaluated using a laser-induced thin film spallation technique. To further examine the application regime of this technique and identify the individual roles of the tensile and shear stress in the resulting interfacial failure, a special sample design is adopted in the current work to realize pure-shear loading at the thin film/substrate interface. Our result demonstrates that for sufficiently high stress amplitude, interfacial failure can be induced solely by the in-plane shear stress and the stress can be quantitatively determined from optical interferometric measurements. Together with the previous tensile and mixed-mode studies, a complete picture of the mode-dependent thin film interfacial strength can now be reliably determined using the laser-induced thin film spallation techniques.

show abstract

Tensile and mixed-mode strength of a thin film-substrate interface under laser induced pulse loading

Cited by 51 publications

References 47 publications

Laser-based Determination of Decohesion and Fracture Strength of Interfaces and Solids by Nonlinear Stress Pulses

Laser-based Determination of Decohesion and Fracture Strength of Interfaces and Solids by Nonlinear Stress Pulses

Dynamic delamination of patterned thin films: a numerical study

Pure-shear Failure of Thin Films by Laser-induced Shear Waves

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